Lead Interdisciplinary Systems Engineer, Mechatronics & Sustainable Packaging (MSP)

Amazon is a global e-commerce and technology company known for innovation in online retail, cloud computing, and artificial intelligence.
Distributed Systems
Principal Software Engineer
In-Person
5,000+ Employees
10+ years of experience
AI · Robotics · Logistics

Description For Lead Interdisciplinary Systems Engineer, Mechatronics & Sustainable Packaging (MSP)

The Lead Interdisciplinary Systems Engineer creates automated packaging platforms and supporting systems to enable faster and more efficient delivery to Amazon's customers. The primary role is to lead the conceptualization and technical development of next-generation packaging platforms and supporting automation systems. This involves designing, simulating, and building packaging machinery and automation that simplifies the fulfillment network, reduces delivery times, and exceeds customer packaging expectations.

Key responsibilities include:

  • Defining, expanding, and exploring the design space for complex, multidisciplinary robotics and automation problems
  • Identifying and analyzing cross-functional tradeoffs between design alternatives
  • Breaking down and framing problems using various system representations
  • Ensuring product safety, reliability, and usability at Amazon scale
  • Building quantitative models and analyses for trade studies and system understanding
  • Performing technical risk assessments and devising mitigation plans
  • Developing system integration and evaluation strategies
  • Driving and prioritizing system test campaigns
  • Mentoring junior engineers and participating in hiring

The role is part of the Mechatronics and Sustainable Packaging (MSP) organization, which aligns mechatronics and packaging to develop, deploy, and scale automated solutions across Amazon's Fulfillment Network. The team focuses on integrating solutions into brownfield and greenfield deployments with safety as a top priority, while also taking ownership of the entire packaging experience to eliminate waste and transition to sustainable materials.

This position offers an opportunity to work on cutting-edge automation and packaging solutions that directly impact Amazon's efficiency and customer satisfaction. The ideal candidate will have a strong background in systems engineering, experience with complex hardware/software systems, and the ability to lead cross-functional teams in developing innovative solutions.

Last updated 16 days ago

Responsibilities For Lead Interdisciplinary Systems Engineer, Mechatronics & Sustainable Packaging (MSP)

  • Lead conceptualization and technical development of next-generation packaging platforms
  • Design, simulate, and build packaging machinery and automation
  • Define and explore design space for complex robotics and automation problems
  • Analyze cross-functional tradeoffs between design alternatives
  • Break down and frame problems using various system representations
  • Ensure product safety, reliability, and usability at Amazon scale
  • Build quantitative models and analyses for trade studies
  • Perform technical risk assessments and devise mitigation plans
  • Develop system integration and evaluation strategies
  • Drive and prioritize system test campaigns
  • Mentor junior engineers and participate in hiring

Requirements For Lead Interdisciplinary Systems Engineer, Mechatronics & Sustainable Packaging (MSP)

Python
  • BS or equivalent in STEM discipline
  • 10+ years of experience
  • Experience with eliciting and clarifying business and end user needs
  • Experience leading technical collaborations across diverse groups
  • Experience identifying and analyzing dependencies, tradeoffs, and sensitivities across multi-disciplinary systems
  • Understanding of systems engineering tools and best practices
  • Experience developing test strategies and plans for complex hardware/software systems

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