Amazon Devices is seeking a Principal Packaging Engineer to join their Device Postponement Operation (DPO) team. This role combines technical expertise in packaging engineering with strategic leadership to drive automation-friendly packaging designs. The position requires an innovative approach to developing packaging solutions that enhance customer experience while optimizing operational efficiency.
The ideal candidate will lead major projects involving new device packaging systems, working at the intersection of material science, automation, and supply chain optimization. They will be responsible for developing new packaging concepts, analyzing material characteristics, and implementing operational test plans for rapid iteration of designs.
At Amazon DPO, the focus is on importing devices in bulk packaging and performing final configurations based on regional demand. The role involves working with highly automated processes to ensure customers receive products efficiently and on time. The team is currently expanding globally from its U.S. base.
The position offers competitive compensation ranging from $147,000 to $254,100 per year, depending on location, plus additional benefits including equity and sign-on payments. This is an excellent opportunity for an experienced packaging professional to make a significant impact on Amazon's global operations and customer experience.
The role requires 10+ years of experience in packaging design engineering and manufacturing, with particular emphasis on consumer electronics packaging. The successful candidate will need to demonstrate expertise in various packaging technologies, including flexo-printing, lithography, corrugated materials, and thermoforming, while maintaining a strong focus on automation and operational efficiency.