Signal and Power Integrity Engineer for IC Package

AWS Utility Computing (UC) is at the forefront of cloud innovation, managing crucial services like S3 and EC2. This role is within the Amazon Dedicated Cloud (ADC) division, specifically in the SIP (Signal-Integrity & Packaging) team at Annapurna Labs.

As a Signal and Power Integrity Engineer, you'll be responsible for developing and managing electrical interfaces for advanced chip designs. The role combines expertise in package design, back-end integration, and SI/PI simulations. You'll work on critical components including DRAM, PCIe, and Ethernet SerDeses interfaces.

Key Responsibilities:

• Lead electrical aspects of physical interfaces for advanced I/Os
• Manage Die-level integration and I/O ring design
• Conduct SI/PI extractions and simulations
• Design complex package substrates
• Collaborate with Backend team on floor-planning

AWS offers an inclusive culture that values diverse experiences and work-life harmony. The company provides extensive opportunities for professional growth through mentorship programs and career development resources. As part of the AWS team, you'll contribute to innovative solutions that power businesses from startups to Global 500 companies.

The position offers:

• Cutting-edge work in chip development
• Collaborative environment with expert teams
• Career advancement opportunities
• Flexible working culture
• Inclusive team environment with employee-led affinity groups
• Continuous learning and development

Join AWS to be part of a team that's shaping the future of cloud computing while working on challenging technical problems in chip design and electrical engineering.