Signal and Power Integrity Engineer for IC Package

World's most comprehensive and broadly adopted cloud platform, pioneering cloud computing and continuous innovation.
$120,000 - $200,000
Embedded
Senior Software Engineer
In-Person
5,000+ Employees
5+ years of experience
Enterprise SaaS · Cloud

Description For Signal and Power Integrity Engineer for IC Package

AWS Utility Computing (UC) is at the forefront of cloud innovation, managing crucial services like S3 and EC2. This role is within the Amazon Dedicated Cloud (ADC) division, specifically in the SIP (Signal-Integrity & Packaging) team at Annapurna Labs.

As a Signal and Power Integrity Engineer, you'll be responsible for developing and managing electrical interfaces for advanced chip designs. The role combines expertise in package design, back-end integration, and SI/PI simulations. You'll work on critical components including DRAM, PCIe, and Ethernet SerDeses interfaces.

Key Responsibilities:

  • Lead electrical aspects of physical interfaces for advanced I/Os
  • Manage Die-level integration and I/O ring design
  • Conduct SI/PI extractions and simulations
  • Design complex package substrates
  • Collaborate with Backend team on floor-planning

AWS offers an inclusive culture that values diverse experiences and work-life harmony. The company provides extensive opportunities for professional growth through mentorship programs and career development resources. As part of the AWS team, you'll contribute to innovative solutions that power businesses from startups to Global 500 companies.

The position offers:

  • Cutting-edge work in chip development
  • Collaborative environment with expert teams
  • Career advancement opportunities
  • Flexible working culture
  • Inclusive team environment with employee-led affinity groups
  • Continuous learning and development

Join AWS to be part of a team that's shaping the future of cloud computing while working on challenging technical problems in chip design and electrical engineering.

Last updated 15 hours ago

Responsibilities For Signal and Power Integrity Engineer for IC Package

  • Deep dive into electrical IPs, integrated into the DIE
  • I/O ring design and work with Backend team on floor-planning
  • Lead test studies of Die bump-out arrangements and Package substrate breakout
  • Design large and complex package substrates
  • Carry advanced SI/PI extractions and simulations
  • Lead layout test studies of package pin-out arrangements and PCB board breakout

Requirements For Signal and Power Integrity Engineer for IC Package

  • BSc in Electrical Engineering
  • Experience in Layout (PCB or Package), or BackEnd integration of electrical IPs
  • Familiarity with Signal and Power integrity simulation tools
  • Strong passion to learn and gain deep understanding

Benefits For Signal and Power Integrity Engineer for IC Package

Medical Insurance
Dental Insurance
Vision Insurance
  • Work-life harmony
  • Career development opportunities
  • Mentorship programs
  • Inclusive work environment
  • Employee-led affinity groups
  • Continuous learning resources

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