Sr. ASIC Packaging Engineer

AWS Utility Computing (UC) is at the forefront of cloud innovation, developing cutting-edge solutions through Annapurna Labs, their specialized hardware division. This senior role focuses on designing and implementing next-generation machine learning chips and servers. As a Sr. ASIC Packaging Engineer, you'll join a dynamic team working on unprecedented technical challenges in cloud computing and AI acceleration.

The position offers a unique opportunity to impact the growing field of machine learning through hardware innovation. You'll collaborate with architects, design teams, and software engineers to deliver next-generation ML chips, focusing on IP integration, 2.5D design, bring-up, characterization, and validation.

AWS values diverse experiences and maintains an inclusive culture through employee-led affinity groups and ongoing learning experiences. The team emphasizes knowledge-sharing and mentorship, supporting both experienced professionals and those with non-traditional backgrounds. You'll work in an environment that celebrates continuous learning and professional growth.

The role combines technical expertise with strategic thinking, requiring collaboration across multiple teams and vendors. You'll be responsible for evaluating and implementing packaging technologies, managing thermal and mechanical performance, and ensuring product quality through various development stages.

Working at AWS means joining a pioneer in cloud computing that continues to shape the industry's future. The company offers a supportive environment that values work-life harmony and provides numerous opportunities for career advancement. You'll be part of a team that's dedicated to solving complex challenges and delivering innovative solutions that help customers worldwide transform their businesses through cloud technology.