Sr. ASIC Packaging Engineer

World's most comprehensive and broadly adopted cloud platform, pioneering cloud computing and continuous innovation.
Hardware Development
Senior Software Engineer
In-Person
5,000+ Employees
10+ years of experience
AI · Enterprise SaaS · Cloud

Description For Sr. ASIC Packaging Engineer

AWS Utility Computing (UC) is at the forefront of cloud innovation, developing cutting-edge solutions through Annapurna Labs, their specialized hardware division. This senior role focuses on designing and implementing next-generation machine learning chips and servers. As a Sr. ASIC Packaging Engineer, you'll join a dynamic team working on unprecedented technical challenges in cloud computing and AI acceleration.

The position offers a unique opportunity to impact the growing field of machine learning through hardware innovation. You'll collaborate with architects, design teams, and software engineers to deliver next-generation ML chips, focusing on IP integration, 2.5D design, bring-up, characterization, and validation.

AWS values diverse experiences and maintains an inclusive culture through employee-led affinity groups and ongoing learning experiences. The team emphasizes knowledge-sharing and mentorship, supporting both experienced professionals and those with non-traditional backgrounds. You'll work in an environment that celebrates continuous learning and professional growth.

The role combines technical expertise with strategic thinking, requiring collaboration across multiple teams and vendors. You'll be responsible for evaluating and implementing packaging technologies, managing thermal and mechanical performance, and ensuring product quality through various development stages.

Working at AWS means joining a pioneer in cloud computing that continues to shape the industry's future. The company offers a supportive environment that values work-life harmony and provides numerous opportunities for career advancement. You'll be part of a team that's dedicated to solving complex challenges and delivering innovative solutions that help customers worldwide transform their businesses through cloud technology.

Last updated 3 months ago

Responsibilities For Sr. ASIC Packaging Engineer

  • Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
  • Engage with product architect and design teams on future products package and assembly needs
  • Define the substrate and package BOM of the ICs in collaboration with Package Design team
  • Assume full ownership of mechanical and thermal performance of Annapurna ICs
  • Ensure testability of the ICs in collaboration with Test Engineer team
  • Track assembly and substrate yields and look for ways to improve them
  • Work with Assembly, Test and Logistics to define work flows at OSATs

Requirements For Sr. ASIC Packaging Engineer

Python
  • B.Sc. or M.Sc. degree in Electrical Engineering, Applied Physics or related fields
  • 10+ years of professional experience in similar role
  • Good understanding of transmission line theory, power delivery and signal integrity
  • Strong programming and scripting skills in Perl, Python, Tcl
  • Cadence Skill and EXCEL familiarity
  • High communication skills
  • Strong analytic and problem-solving skills
  • Ability to work independently on multiple issues

Benefits For Sr. ASIC Packaging Engineer

  • Work-life harmony
  • Mentorship and career growth opportunities
  • Knowledge-sharing and learning experiences
  • Employee-led affinity groups
  • Inclusive team culture

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