Sr. IC Packaging Design Engineer, Project Kuiper

Project Kuiper, an ambitious Amazon initiative, is revolutionizing global connectivity through a constellation of Low Earth Orbit satellites. As a Senior IC Packaging Design Engineer, you'll be at the forefront of developing innovative packaging solutions for mm-wave beamforming SoCs and front-end modules. This role combines technical expertise with strategic thinking, as you'll work to create reliable, cost-effective packaging solutions that power satellite communications.

You'll collaborate with cross-disciplinary teams and third-party suppliers, driving everything from initial product definition to optimization and volume production. The position requires deep technical knowledge in IC packaging, with responsibilities spanning design, manufacturing, reliability testing, and vendor management. You'll be instrumental in defining package architectures, conducting reliability assessments, and ensuring quality through rigorous testing and qualification processes.

This is an exceptional opportunity for an experienced engineer to make a significant impact on a project that aims to provide high-speed broadband connectivity to underserved communities worldwide. The role offers competitive compensation ($143,300-$247,600 based on location), comprehensive benefits, and the chance to work with cutting-edge technology in satellite communications.

The ideal candidate will bring strong technical expertise in IC packaging, demonstrated success in volume production environments, and excellent collaborative skills. You'll need to be adaptable, detail-oriented, and capable of thriving in a fast-paced environment while maintaining high standards of excellence. This position offers the unique opportunity to contribute to a project that combines technological innovation with social impact, all while working for one of the world's leading technology companies.