Apple is seeking an Advanced Package Development Engineer to join their Hardware team in Santa Clara. This role offers an exceptional opportunity to work on technologies that impact billions of users worldwide. The position focuses on advanced packaging technologies and requires expertise in silicon fab interconnect process integration, materials science, and equipment management. You'll be working in a cross-functional team, developing cutting-edge packaging solutions for Apple's innovative products.
The ideal candidate will bring 3+ years of industry experience with a strong background in silicon fabrication, package integration, and technology development. You'll be responsible for driving vendor relationships, conducting independent R&D work, and ensuring the highest standards of quality and reliability in package development.
This role offers a competitive compensation package including a base salary range of $121,900 to $214,500, plus additional benefits such as stock options, comprehensive healthcare, and education reimbursement. You'll be part of Apple's mission to create groundbreaking technologies while working with some of the industry's best talents in the heart of Silicon Valley.
The position requires deep technical knowledge combined with excellent communication skills, as you'll be collaborating across teams and with vendors. You'll have the opportunity to work on advanced CMOS nodes and contribute to next-generation packaging solutions that will be used in future Apple products. If you're passionate about hardware development and want to make a significant impact in the tech industry, this role offers an exciting career opportunity at one of the world's most innovative companies.