IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an IC Package Design Engineer to work on sophisticated package selection, new generation product package structure, and configuration optimization for consumer electronic products such as iPhone, iPad, Mac, Apple Watch, and Apple TV. In this highly visible role, you will be responsible for Package/SIP/module physical design and layout, optimization, DV, and tape out. You will work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.

Key responsibilities include:

• Implementing physical design of packages and modules for SoC, Memory, RF, and cellular chips
• Interfacing with multi-functional groups on new product package/SiP/module feasibility analysis, design, and selection
• Defining and developing design verification and automation strategies
• Optimizing package pin out and performing extraction of S-parameters and package RLGC models
• Ensuring package design is optimized with SI/PI requirements
• Driving methodology, innovations, and efficiency improvements in package design
• Exploring and developing new CAD tools, design, and verification flows
• Partnering with Silicon PD team to optimize chip Floorplan and bump placement

The ideal candidate will have a BS degree and 3+ years of relevant industry experience, with knowledge in electrical/material/thermal/mechanical engineering fields. Experience with Cadence Allegro or Mentor Xpedition tools, understanding of SI/PI tools, and knowledge of substrate manufacturing processes are preferred.

Apple offers a competitive compensation package, including base pay between $135,400 and $250,600, discretionary restricted stock unit awards, and comprehensive benefits. Join Apple's team and contribute to the development of cutting-edge hardware technologies.