IC Package Design Engineer

Apple is a leading technology company that creates consumer electronics products like iPhone, iPad, Mac, Apple Watch, and Apple TV.
$135,400 - $250,600
Embedded
Mid-Level Software Engineer
In-Person
5,000+ Employees
3+ years of experience
Consumer

Description For IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an IC Package Design Engineer to join their innovative team. This role is crucial in developing electronic packaging solutions for Apple's consumer electronics products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As an IC Package Design Engineer, you'll be responsible for sophisticated package selection, new generation product package structure, and configuration optimization. You'll work with cross-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.

The position offers a competitive base salary range of $135,400 to $250,600, along with comprehensive benefits including medical and dental coverage, retirement benefits, and stock programs. You'll have the opportunity to work with cutting-edge technology and contribute to products used by millions of people worldwide.

The ideal candidate should have at least 3 years of experience, strong fundamentals in electrical/material/thermal engineering, and proficiency in industry-standard tools like Cadence Allegro or Mentor Xpedition. Knowledge of high-speed interfaces, Unix environment, and scripting languages is essential. You'll be working in a collaborative environment, partnering with various teams to drive innovation in package design and verification.

This role offers excellent growth opportunities, including education reimbursement for career advancement and the chance to work on next-generation consumer electronics. Join Apple's team in Irvine, California, and be part of a company that values inclusion, diversity, and technological innovation.

Last updated a day ago

Responsibilities For IC Package Design Engineer

  • Implement physical design of packages and modules for SoC, Memory, RF and cellular chips
  • Interface with multi-functional groups on new product package/SiP/module feasibility analysis, design and selection
  • Define and develop design verification and automation strategy
  • Optimize package pin out
  • Perform extraction of S-parameters and package RLGC model
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements
  • Explore and develop new CAD tool, design and verification flow
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement

Requirements For IC Package Design Engineer

Python
Linux
  • BS and 3+ years of relevant industry experience
  • Fundamental knowledge in electrical/material/thermal/mechanical engineering
  • Experience with Cadence Allegro platform tools or Mentor Xpedition platform tools
  • Understanding of SI/PI tools and package model extraction
  • Knowledge of substrate manufacturing process and design rules
  • Understanding of high-speed interfaces
  • Experience with Unix environment and scripting languages

Benefits For IC Package Design Engineer

Medical Insurance
Dental Insurance
Education Budget
Equity
Relocation Benefits
  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Employee stock programs
  • Education reimbursement
  • Discretionary bonuses
  • Relocation benefits
  • Employee discount on products
  • Free services

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