IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an IC Package Design Engineer to join their innovative team. This role is crucial in developing electronic packaging solutions for Apple's consumer electronics products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As an IC Package Design Engineer, you'll be responsible for sophisticated package selection, new generation product package structure, and configuration optimization. You'll work with cross-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.

The position offers a competitive base salary range of $135,400 to $250,600, along with comprehensive benefits including medical and dental coverage, retirement benefits, and stock programs. You'll have the opportunity to work with cutting-edge technology and contribute to products used by millions of people worldwide.

The ideal candidate should have at least 3 years of experience, strong fundamentals in electrical/material/thermal engineering, and proficiency in industry-standard tools like Cadence Allegro or Mentor Xpedition. Knowledge of high-speed interfaces, Unix environment, and scripting languages is essential. You'll be working in a collaborative environment, partnering with various teams to drive innovation in package design and verification.

This role offers excellent growth opportunities, including education reimbursement for career advancement and the chance to work on next-generation consumer electronics. Join Apple's team in Irvine, California, and be part of a company that values inclusion, diversity, and technological innovation.