IC Package Design Engineer

Apple is a leading technology company that creates consumer electronics products like iPhone, iPad, Mac, Apple Watch, and Apple TV.
$175,800 - $312,200
Embedded
Staff Software Engineer
In-Person
5,000+ Employees
10+ years of experience
Consumer

Description For IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an experienced IC Package Design Engineer to join their innovative team. This role is crucial in developing electronic packaging solutions for Apple's flagship products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As an IC Package Design Engineer, you'll be at the forefront of package design and integration, working with cutting-edge technology and multi-functional teams.

The position offers an opportunity to work on sophisticated package selection, new generation product package structure, and configuration optimization. You'll be responsible for Package/SIP/module physical design and layout, working to achieve optimized mechanical, electrical, and thermal performance for various types of chips. The role requires expertise in package design tools, SI/PI requirements, and substrate manufacturing processes.

Working at Apple means joining a company that values innovation and excellence. The compensation package is competitive, including a base salary range of $175,800 to $312,200, plus additional benefits such as stock options, comprehensive healthcare, and educational support. You'll be part of a team that drives methodology improvements, explores new technologies, and directly impacts the development of Apple's next-generation products.

The ideal candidate will bring 10+ years of relevant experience, strong technical knowledge in package design, and the ability to work effectively with cross-functional teams. This is an excellent opportunity for someone passionate about hardware engineering who wants to make a significant impact on products used by millions of people worldwide.

Last updated 15 hours ago

Responsibilities For IC Package Design Engineer

  • Implement physical design of packages and modules for SoC, Memory, RF and cellular chips
  • Interface with multi-functional groups on new product package/SiP/module feasibility analysis, design and selection
  • Define and develop design verification and automation strategy
  • Optimize package pin out
  • Perform extraction of S-parameters and package RLGC model
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements
  • Explore and develop new CAD tool, design and verification flow
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement

Requirements For IC Package Design Engineer

Python
Linux
  • BS and 10+ years of relevant industry experience
  • Proven fundamentals in electrical/material/thermal/mechanical engineering
  • Experience with Cadence Allegro platform tools or Mentor Xpedition platform tools
  • Understanding of SI/PI tools, package model extraction
  • Knowledge of substrate manufacturing process
  • Understanding of high-speed interfaces
  • Experience with Unix environment and scripting languages
  • Familiarity with various package configurations and assembly technology

Benefits For IC Package Design Engineer

Medical Insurance
Dental Insurance
Education Budget
Equity
Relocation Benefits
  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Employee stock programs
  • Educational expense reimbursement
  • Discretionary bonuses
  • Relocation benefits
  • Employee discount on products
  • Free services

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