IC Package Design Engineer

Apple's Hardware Technology Packaging team is seeking an experienced IC Package Design Engineer to join their innovative team. This role is crucial in developing electronic packaging solutions for Apple's flagship products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As an IC Package Design Engineer, you'll be at the forefront of package design and integration, working with cutting-edge technology and multi-functional teams.

The position offers an opportunity to work on sophisticated package selection, new generation product package structure, and configuration optimization. You'll be responsible for Package/SIP/module physical design and layout, working to achieve optimized mechanical, electrical, and thermal performance for various types of chips. The role requires expertise in package design tools, SI/PI requirements, and substrate manufacturing processes.

Working at Apple means joining a company that values innovation and excellence. The compensation package is competitive, including a base salary range of $175,800 to $312,200, plus additional benefits such as stock options, comprehensive healthcare, and educational support. You'll be part of a team that drives methodology improvements, explores new technologies, and directly impacts the development of Apple's next-generation products.

The ideal candidate will bring 10+ years of relevant experience, strong technical knowledge in package design, and the ability to work effectively with cross-functional teams. This is an excellent opportunity for someone passionate about hardware engineering who wants to make a significant impact on products used by millions of people worldwide.