IC Package Integration Manager

Apple is seeking an exceptional IC Package Integration Manager to join their Hardware team in driving innovation in semiconductor packaging technology. This role presents an exciting opportunity to work on groundbreaking technologies that enable amazing new products at one of the world's most influential tech companies.

The position requires a seasoned professional with 10+ years of experience in semiconductor packaging design and technology development. You'll be at the forefront of developing and implementing advanced packaging solutions, working with cross-functional teams and third-party partners to bring concepts to mass production.

As an IC Package Integration Manager, you'll lead critical initiatives in package integration and architecture, requiring deep expertise in various aspects including Si floor plan, package layout, thermal management, mechanical design, and system-level reliability. The role demands excellent problem-solving abilities, strong physics fundamentals, and outstanding communication skills to collaborate effectively with internal teams and overseas suppliers.

The position offers a competitive base salary range of $219,300 to $378,700, complemented by comprehensive benefits including medical and dental coverage, retirement benefits, and various stock participation opportunities. You'll also have access to education reimbursement for career advancement and employee discount programs.

This is an ideal role for a technical leader who thrives in a fast-paced environment and wants to make a significant impact on next-generation technology products. You'll have the opportunity to drive industry standards with advanced package solutions while working with state-of-the-art tools and technologies. The position involves approximately 10% international travel, offering exposure to global operations and industry partners.

Working at Apple means being part of a company that values innovation, attention to detail, and excellence in everything they do. You'll be joining a team that's passionate about creating extraordinary products and pushing the boundaries of what's possible in semiconductor packaging technology.