Apple is seeking a dedicated IC Packaging Engineering Lead to join their Hardware team in driving innovation in semiconductor packaging technology. This role offers an exciting opportunity to work on groundbreaking technologies that enable amazing new products at one of the world's leading technology companies.
The position involves leading package integration and architecture efforts, working closely with cross-functional teams and third-party partners to develop and implement advanced packaging solutions. You'll be responsible for taking innovative packaging concepts through to mass production, including package, module, and technology development.
The ideal candidate will bring strong technical expertise in semiconductor packaging design, with a comprehensive understanding of various aspects including Si floor plan, package layout, thermal considerations, mechanical engineering, and system-level reliability. You'll need excellent problem-solving abilities, strong communication skills, and the capability to work both independently and as a team leader.
This role offers a competitive compensation package, including a base salary range of $143,100 to $264,200, plus additional benefits such as stock options, comprehensive healthcare, and education reimbursement. You'll be part of Apple's culture of innovation, where new ideas rapidly transform into extraordinary products and services.
The position requires approximately 10% international travel and offers the opportunity to work with cutting-edge technology while driving industry standards. You'll be joining a company known for its commitment to excellence and innovation, with the chance to make significant contributions to next-generation product development.