IC Packaging Engineer – WLP
Description For IC Packaging Engineer – WLP
Apple is seeking an IC Packaging Engineer to join their Hardware team in Santa Clara. This role focuses on groundbreaking technology and product development, specifically in IC packaging technology. The position involves leading packaging technology development, including advanced 2.5D/3D packaging, and working with multi-functional teams on SoC Package integration. The ideal candidate will have 3+ years of experience in semiconductor packaging, with strong knowledge of materials characterization and packaging technologies. The role offers comprehensive benefits including medical coverage, stock options, and educational support. This is an opportunity to work on cutting-edge technology while contributing to Apple's innovative product lineup. The position offers competitive compensation ranging from $143,100 to $264,200, with additional benefits and growth opportunities. The role requires occasional international travel (5%) and combines technical expertise with project management skills.
Responsibilities For IC Packaging Engineer – WLP
- Lead packaging technology development including advanced 2.5D/3D packaging
- Work with multi-functional team and lead SoC Package integration efforts
- Package Architecture / Package Integration Innovation
- Work with foundry and OSAT to bring packaging solution from concept to HVM
- Drive industry with sophisticated Package solutions, new material development, and specs
- 5% International travel
Requirements For IC Packaging Engineer – WLP
- BS and 3+ years of relevant industry experience
- Experience working in the Semiconductor Packaging field
- Knowledge of materials characterization and analysis
- Understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology
- Understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques
- Excellent interpersonal skills
- Ability to work independently
- Experience with package design softwares, APD, Virtuoso
- Knowledge of memory packaging
- Program management skills
Benefits For IC Packaging Engineer – WLP
- Comprehensive medical and dental coverage
- Retirement benefits
- Discounted products and free services
- Education reimbursement
- Employee stock programs
- Discretionary restricted stock unit awards
- Employee Stock Purchase Plan
- Discretionary bonuses
- Relocation benefits
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