IC Packaging Integration Engineer

Apple is seeking a talented IC Packaging Integration Engineer to join their Hardware team in Santa Clara. This role offers an exciting opportunity to work on groundbreaking technologies that enable amazing new products. The position requires a seasoned professional with 10+ years of experience who will be responsible for IC packaging development and leading SoC Package integration efforts.

The ideal candidate will bring expertise in semiconductor packaging and system integration, with a comprehensive understanding of package layout, architecture, thermal mechanics, and reliability testing. You'll work with cross-functional teams to drive industry-leading package solutions and new material developments.

This role offers a competitive base salary range of $175,800 to $312,200, along with impressive benefits including stock options, medical coverage, and education reimbursement. At Apple, you'll be part of a team that believes in turning new ideas into extraordinary products and services.

The position demands excellent problem-solving abilities, strong physics fundamentals, and outstanding communication skills to work effectively with internal teams and overseas suppliers. You'll have the opportunity to make significant contributions to Apple's innovative hardware solutions while working with cutting-edge technology.

Join Apple's hardware team and be part of a company that values creativity, excellence, and technological advancement. This role offers both technical challenges and leadership opportunities, making it perfect for someone who wants to shape the future of hardware technology while working with industry-leading professionals.