Packaging Characterization Engineer

Apple designs and develops consumer electronic products including iPhone, iPad, Mac, Apple Watch, and Apple TV.
$143,100 - $214,500
Hardware
Mid-Level Software Engineer
In-Person
5,000+ Employees
3+ years of experience
Consumer

Description For Packaging Characterization Engineer

Apple's Hardware Technology Packaging team is seeking a Packaging Characterization Engineer to join their innovative group. This role is integral to the development of electronic packaging solutions for Apple's flagship products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As a Packaging Characterization Engineer, you'll be responsible for sophisticated package selection, new generation product package structure, and configuration optimization. The position offers an opportunity to work with cutting-edge technology and multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.

The role combines technical expertise with collaborative teamwork, requiring strong skills in package design, verification, and optimization. You'll work with state-of-the-art tools and technologies, implementing physical designs for SoC, Memory, RF, and cellular chips. The position offers competitive compensation, comprehensive benefits, and the chance to contribute to products used by millions globally.

Working at Apple means joining a team that values innovation and excellence. You'll have access to advanced resources and tools, while collaborating with talented professionals across different disciplines. The role offers growth opportunities through educational reimbursement and participation in employee stock programs. If you're passionate about hardware engineering and want to make an impact on next-generation consumer electronics, this position offers an exciting opportunity to work with one of the world's leading technology companies.

Last updated 2 days ago

Responsibilities For Packaging Characterization Engineer

  • Implement physical design of packages and modules for SoC, Memory, RF and cellular chips
  • Interface with multi-functional groups on new product package/SiP/module analysis
  • Define and develop design verification and automation strategy
  • Optimize package pin out
  • Perform extraction of S-parameters and package RLGC model
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements
  • Explore and develop new CAD tool, design and verification flow
  • Partner with Silicon PD team to optimize chip Floorplan

Requirements For Packaging Characterization Engineer

Python
Linux
  • BS and 3+ years of relevant industry experience
  • Proven fundamentals in electrical/material/thermal/mechanical engineering
  • Experience with Cadence Allegro platform tools or Mentor Xpedition platform tools
  • Basic understanding of SI/PI tools
  • Knowledge of substrate manufacturing process
  • Understanding of high-speed interfaces
  • Experience with Unix environment and scripting languages

Benefits For Packaging Characterization Engineer

Medical Insurance
Dental Insurance
401k
Equity
Education Budget
Relocation Benefits
  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Employee stock programs
  • Educational reimbursement
  • Discretionary bonuses
  • Relocation assistance
  • Employee discount on products
  • Free services

Interested in this job?

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