Apple's Hardware Technology Packaging team is seeking a Packaging Substrate Engineer to join their innovative group. This role is integral to the development and integration of electronic packaging solutions for Apple's flagship products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As a Packaging Substrate Engineer, you'll be at the forefront of developing sophisticated package solutions, working with cutting-edge technology and leading cross-functional teams.
The position offers an exciting opportunity to work with state-of-the-art substrate technology and manufacturing processes, while collaborating with industry partners to bring concepts to high-volume manufacturing. You'll be responsible for driving SoC package substrate development, defining technology roadmaps, and ensuring the best package performance for Apple's products.
The role combines technical expertise with leadership, requiring both deep technical knowledge and strong project management skills. You'll work in Apple's dynamic environment where new insights regularly transform into extraordinary products. The position offers competitive compensation, comprehensive benefits, and the chance to contribute to products used by millions globally.
Working at Apple's Santa Clara location, you'll be part of a team that values attention to detail and excellence. The role requires occasional international travel (5%) and offers growth opportunities through hands-on experience with advanced manufacturing processes and emerging technologies. This is an excellent opportunity for an experienced professional looking to make a significant impact in consumer electronics packaging technology.