Packaging Substrate Engineer

Apple is a leading technology company that creates consumer electronic products including iPhone, iPad, Mac, Apple Watch, and Apple TV.
$175,800 - $312,200
Hardware
Staff Software Engineer
In-Person
5,000+ Employees
10+ years of experience
Consumer
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Description For Packaging Substrate Engineer

Apple's Hardware Technology Packaging team is seeking a Packaging Substrate Engineer to join their innovative group. This role is integral to the development and integration of electronic packaging solutions for Apple's flagship products including iPhone, iPad, Mac, Apple Watch, and Apple TV. As a Packaging Substrate Engineer, you'll be at the forefront of developing sophisticated package solutions, working with cutting-edge technology and leading cross-functional teams.

The position offers an exciting opportunity to work with state-of-the-art substrate technology and manufacturing processes, while collaborating with industry partners to bring concepts to high-volume manufacturing. You'll be responsible for driving SoC package substrate development, defining technology roadmaps, and ensuring the best package performance for Apple's products.

The role combines technical expertise with leadership, requiring both deep technical knowledge and strong project management skills. You'll work in Apple's dynamic environment where new insights regularly transform into extraordinary products. The position offers competitive compensation, comprehensive benefits, and the chance to contribute to products used by millions globally.

Working at Apple's Santa Clara location, you'll be part of a team that values attention to detail and excellence. The role requires occasional international travel (5%) and offers growth opportunities through hands-on experience with advanced manufacturing processes and emerging technologies. This is an excellent opportunity for an experienced professional looking to make a significant impact in consumer electronics packaging technology.

Last updated 3 months ago

Responsibilities For Packaging Substrate Engineer

  • Lead SoC package substrate development, pathfinding technology, and roadmap definition
  • Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM
  • Work across cross-functional groups in engineering and product development
  • Drive industry with sophisticated package solutions, new material development, and specs
  • 5% International travel

Requirements For Packaging Substrate Engineer

  • BS and 10+ years of relevant industry experience
  • Proven fundamentals in the material/chemistry/mechanical engineering field(s)
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap

Benefits For Packaging Substrate Engineer

Medical Insurance
Dental Insurance
Equity
Education Budget
Relocation Benefits
  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Employee stock programs
  • Educational reimbursement
  • Discretionary restricted stock unit awards
  • Employee Stock Purchase Plan with discount
  • Discretionary bonuses
  • Relocation benefits

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