Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

As a defect engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will identify, analyze, and minimize defects in the FBAR filter fabrication process. You will work closely with management to define defect objectives, utilize metrology tools and data analysis to define technology baseline defectivity, establish process baselines for new technologies, and lead cross-functional teams investigating out-of-control material. Key responsibilities include defining fab inspection needs, separating nuisance vs. killer defects, driving continuous process improvement, and maintaining fab defect control. You'll also support non-conforming material containment and disposition, and drive a low defect culture across the fab.

The ideal candidate will have a BS in EE, Material Science, Physics, Chemistry, or related field, with 8+ years of experience in high volume wafer fabrication process engineering, defect engineering, or yield enhancement. Strong analytical and problem-solving skills, expertise in Klarity defect analysis software, and advanced knowledge of JMP are required. The ability to work independently, lead cross-functional teams, and communicate effectively with various audiences is crucial.

Preferred qualifications include an MS or PhD in a related field, 12+ years of experience, and advanced skills in physical analysis and defect data automation. Familiarity with cleanroom protocols and safety standards is necessary.

Broadcom offers a competitive compensation package, including an annual base salary range of $107,000 - $171,000, discretionary annual bonus, equity opportunities, and comprehensive benefits including medical, dental, vision, 401(k) with company matching, and paid time off.

Broadcom is an equal opportunity employer and welcomes applicants from diverse backgrounds.

Senior Defect Engineer role at Broadcom Inc., focusing on minimizing defects in FBAR filter fabrication process.

Defect Engineer

The Network Switch Group at Broadcom Inc. has brought some of the most complex and cutting edge networking ASIC's and multi-chip solutions to market over the last decade. These products support the latest networking protocols and features as well as manage extremely large volumes of internet traffic.

As a Principal Physical Design Engineer, you will be responsible for 3nm high speed physical designs. Your responsibilities will include:

- Floorplanning including multi-power domain, PG planning etc.
- Physical implementation of blocks and top-level including clock-tree.
- Physical verification and timing closure for block and chip-level.
- Static and dynamic IR drop analysis, signal and power EM checks.
- Methodology & Flow development of Physical Design and Timing Closure.
- Interfacing with internal and external teams including Design, IP, Library.

The ideal candidate should be well experienced in floor-planning, partitioning, placement, clock tree synthesis, route and physical verification. You should have excellent problem-solving skills to help with congestion resolution and timing closure. Experience with formal verification, timing analysis, and ECO implementation is required. You should be able to work independently and help other team members, possess the ability to learn and adapt to new tools and methodologies, and have excellent communication skills.

Experience with tools such as Innovus, Calibre, LEC, PrimeTime etc. is highly desirable. Full chip tapeout experience based on 3nm technologies is preferred. The position requires BE plus 8+ years, or ME plus 6+ years, in deep-sub-micron IC physical designs, or equivalent experience. Experience with TCL and Perl to achieve higher productivity is desired.

Broadcom offers a competitive and comprehensive benefits package, including medical, dental and vision plans, 401(K) participation with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave, and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer and considers qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

Principal Physical Design Engineer for 3nm high speed designs at Broadcom Inc., a global technology leader in semiconductor and infrastructure software solutions.

Principal Physical Design Engineer (ICB4)

Broadcom is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

Broadcom Inc has an opening for a Field Sales Engineer (FSE) to drive demand creation and revenue goals for Optocouplers, LEDs, Industrial Fiber and Motion Control Encoder products across the Western United States. The FSE will be responsible for cultivating new and existing customers across the entire Western United States area.

Key responsibilities include:
- Leading the design-in of Broadcom's optocouplers, LEDs, industrial fiber and encoder products at Tier 1, 2, 3 customers
- Delivering superior revenue results that have a company-wide impact
- Working jointly with Sales Management, R&D and Applications Engineering to resolve business & technical hurdles during the sales cycle
- Identifying trends and growth drivers in the Industrial, Automotive, Robotic and Medical market spaces to assist Broadcom in new product definition
- Collaborating with distributors to expand the customer base and increase our footprint at targeted customer and in adjacent end markets

The ideal candidate should have a Bachelor's of Science (preferably in Electrical Engineering) and 8+ years semiconductor sales experience. Experience in the industrial, Automotive, Robotic or medical market space is preferred. Broadcom is looking for highly motivated candidates with excellent communication skills who can effectively interface with customers, product divisions, and senior sales management.

Broadcom offers a competitive compensation package, including a base salary plus sales incentive commission, with On Target Earnings (OTE) ranging from $148,000 to $236,000. The position is also eligible for equity awards. The company provides comprehensive benefits including medical, dental, and vision plans, 401(k) with company matching, Employee Stock Purchase Program (ESPP), paid time off, and more.

Join Broadcom and be part of a global technology leader, driving innovation in semiconductor and infrastructure software solutions.

Senior Field Sales Engineer role at Broadcom Inc, driving demand for optocouplers, LEDs, and industrial products across Western US.

Sr. Field Sales Engineer

As a DCIM Process Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will own, optimize, troubleshoot and develop processes on thin film semiconductor equipment. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before moving them in high volume manufacturing. You will be involved in supporting both production and R&D teams in a high volume dynamic product mix-manufacturing environment.

Specific Objectives and Responsibilities:
- Work with peers, quality and R&D teams to address safety, quality, yield, reliability, productivity, cycle time, and cost reduction efforts in areas of ownership.
- Responsible for process development of thin film deposition solutions that are stable, well characterized and self-sustainable.
- Respond to process and product deviations to aid on the investigation and solution of potential issues.
- Characterize and document improvements via established methods and systems. Maintain and update documentation for all impacted customers. Use statistical methods to communicate results and drive improvements.
- Work with process development groups and others in manufacturing to ensure tools and processes meet the quality standards.
- Be involved at times in new tool selection, acceptance, and start-up as well as optimization and upgrade work to improve performance on tooling platforms.
- Establish KPI's and utilize SPC/FDC to monitor performance with robust setups to detect tool deviations and establish preventive maintenance.
- Support Operations team with clear communication of how to support equipment and establish clear documentation.
- Communicate to all levels of the organization as needed progression of work with clear timelines and objectives.

Requirements:
- BS (MS preferred) in EE, ME, ChE, Material Science, Physics or Chemistry.
- 5+ years of experience with wafer process manufacturing equipment process development and troubleshooting in HVM.
- Experience with thin film deposition tools and characterization methods for CVD processes.
- Experience with MEMS devices and interaction between unit processes on device performance a plus.
- Solid understanding of SPC, data driven decision making and able to demonstrate problem-solving skills through controlled documented processes to minimize risk.
- Excellent teamwork, good verbal and written communication skills. Self-motivated, able to organize, coordinate and handle multiple tasks at once and self-prioritize to meet expectations.
- Familiar with statistical methods and software. JMP, Klarity, FDC, Microsoft Suite, etc.
- Attention to detail is essential.
- Legal authorization to work in the U.S. is required

Broadcom offers a competitive and comprehensive benefits package including medical, dental and vision plans, 401(K) participation with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.

DCIM Process Engineer at Broadcom Inc. to optimize and develop thin film semiconductor processes in high volume manufacturing.

DCIM Process Engineer

Broadcom Inc., Dune R&D Center (StrataDNX product-line) is seeking exceptional, innovative software engineers to develop next-generation cutting-edge networking platforms. These platforms are at the core of AI networks, Global Internet, Core Routers, Carrier Networks, Service Providers, Data Centers, White Box systems, Enterprise systems, and Telecom infrastructure.

As a Software Engineer, you will join the software development group and take a leading part in the full life-cycle software development. This includes design and coding of Networking Software APIs, Data-path Programming, Management of different Software and Hardware Components, testing during the early stages of features, optimizations, debugging, providing tools, and integration into customer products.

Requirements:
- B.Sc. in Computer Science, Software Engineering or a related field from a recognized university, cum laude
- At least 3 years of experience in C/C++ SW Development or exceptional graduate
- Passionate, Responsible and Team-player
- Quick learner with the ability to adopt new technologies and methodologies

Advantages:
- Experience in Software-Embedded/Real-Time Software development
- Experience working in Linux environment
- Background knowledge in Networking protocols (e.g. Ethernet, IP, how switching/routing works)

Broadcom is proud to be an equal opportunity employer and considers qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by law.

Join Broadcom and be part of a team developing innovative networking solutions that power the world's connectivity!

Join Broadcom as a Software Engineer to develop cutting-edge networking platforms for AI, Internet, and Telecom infrastructure.

Software Engineer

Broadcom Inc. is seeking a highly motivated Change Management Specialist with additional Technical Writer and Editor experience to join our team. The position entails tracking and implementing change requests for documentation that supports our division. The ideal candidate will possess skills in excellent communication skills, attention to detail, problem-solving, working collaboratively with various stakeholders, writing, and editing. This job is an in-office support position. It is not a remote job. This job is divided between the two roles: 75% in Change Management, 25% in Technical Writing.

Key Responsibilities:
- Comply with ISO 9001 document control requirements
- Support the creation and submission of permanent implementation orders
- Review and process permanent change orders
- Update web pages and links for change orders
- Manage document control integrity and perform archival and record retention
- Create, develop, write, edit, and deliver technical documentation
- Champion documentation programs and improve quality of assigned documents
- Participate in peer reviews and project planning
- Explain technical ideas in simple language and write clear processes and procedures

Required Qualifications:
- Excellent verbal and written communication skills
- Strong knowledge of technical writing fundamentals and industry standard writing styles
- Ability to learn complex concepts quickly and explain them clearly
- Self-motivated with strong problem-solving skills
- Experience with change management processes and document control applications
- Proficiency in Microsoft Office and Adobe applications
- B.A./B.S. in a Technical Discipline or English/Technical Communications, or 4 years equivalent in a related field and 5+ years related work experience

Desired Qualifications:
- Knowledge of IC Fabrication processes and semiconductor manufacturing
- Experience with Product Lifecycle Management and Business Process Management
- M.A./M.S. in a Technical Discipline and English or Technical Communications

This is an in-office position located in Fort Collins, Colorado. The role offers competitive compensation, including a base salary range of $71,000 - $113,000, discretionary annual bonus, equity, and comprehensive benefits package.

Broadcom Inc. seeks a Change Management Specialist / Technical Writer, Editor for document control and technical writing in Fort Collins, CO.

Change Management Specialist / Technical Writer, Editor

Broadcom Inc. is seeking a creative and self-motivated Digital IC Design Engineer to join the Data Center Solutions Group. The role involves writing RTL code in Verilog and/or SystemVerilog to execute functions specified in engineering design specifications. Responsibilities include high-level architecture specification analysis, electronic design specification generation, high-quality RTL implementation, working with cross-functional teams, documenting RTL code and verification environments, designing logic for NVMe and PCIe specifications, and supporting chip progression through verification, emulation, and validation.

Key responsibilities:
• Analyze and author high-level architecture specifications
• Generate electronic design specifications, including micro-architecture development
• Implement high-quality, high-performance Verilog/SystemVerilog RTL
• Collaborate with Verification, Firmware, and Systems Engineering teams
• Document RTL code and verification environments
• Design logic for NVMe and PCIe specifications
• Support chip progression through various stages

Required qualifications:
• BS in Electrical or Electronic Engineering with 12+ years of experience, or MSEE with 10+ years of experience
• Digital design product development experience
• Expertise in digital design and verification tools and methodologies
• Strong teamwork and leadership skills
• Excellent analytical and problem-solving abilities
• Outstanding oral and written communication skills
• Experience with NVMe and PCIe is a plus

Broadcom offers a competitive compensation package, including base salary, annual bonus, and equity opportunities. Comprehensive benefits include medical, dental, vision, 401(k) with company matching, ESPP, EAP, paid holidays, sick leave, and vacation time.

Broadcom is an equal opportunity employer, considering qualified applicants without discrimination based on protected characteristics. They also consider qualified applicants with arrest and conviction records in accordance with local laws.

Broadcom Inc. is hiring a Senior IC Design Engineer to develop RTL code for data center solutions, focusing on Verilog/SystemVerilog implementation and NVMe/PCIe specifications.

IC Design Engineer

As an Integration Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will support high volume manufacture of (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies. This highly motivated individual will apply their technical expertise to maximizing yields, performance and quality on new and existing filter products while balancing cost and production efficiency. Integration team members work closely with process and equipment engineers, FBAR process R&D, product development, and quality teams to ensure that all products and technologies are produced in a robust manufacturing environment.

Primary Objectives and Responsibilities:
- Work with peers and cross functional partners in manufacturing, development, quality and new product introduction to improve and stabilize new and existing processes
- Identify, create and maintain process controls and metrics for critical and key electrical and physical parameters
- Take ownership of newly MR'd processes to address and complete any outstanding issues and drive continuous improvement in metrics
- Establish project objectives, schedules and resource profiles for projects
- Address issues and coordinate analysis and improvement of parametric and fab metrics
- Work with QA, reliability resources, unit process owners, and product engineers to track, plan, and coordinate process change qualifications
- Develop and maintain control plans and FMEA's for processes
- Champion integration investigations and determine root cause of integrated related scrap events
- Partner with manufacturing engineering to establish qualification plans for process changes
- Participate in R&D process development to assist limited R&D resources and capture defectivity issues and manufacturability concerns
- Know the FBAR process flows in depth, including ownership and understanding of design rules
- Responsible for all NPI introduction into the fab, from mask review to implementing design values
- Close partnership with NPI teams regarding new technology intersection
- Develop technology variants to reduce cost and improve manufacturability

Technical Experience Required:
- BS (MS or higher preferred) in Physics, EE, ME, ChE, Materials Science or related engineering discipline
- Five or more years of experience in wafer process technology development and/or manufacturing
- Understanding of wafer fabrication processes and their impact on the final product
- Strong analytical skills in DOE, data analysis, SPC, FMEA and related tools
- Experience with failure analysis methods and understanding of basic device failure mechanisms
- Excellent teamwork, good verbal and written communication skills
- Basic understanding of RF principles and applications and knowledge of BAW, SAW, FBAR and associated handset architectures is helpful

Broadcom offers a competitive compensation package including base salary, annual bonus, equity, and comprehensive benefits.

FBAR Integration Engineer at Broadcom Inc. to support high volume manufacture of piezoelectric MEMs process technologies, focusing on yield, performance, and quality optimization.

Broadcom Inc. Engineering Jobs

Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.