FBAR Integration Engineer

As an Integration Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will support high volume manufacture of (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies. This highly motivated individual will apply their technical expertise to maximizing yields, performance and quality on new and existing filter products while balancing cost and production efficiency. Integration team members work closely with process and equipment engineers, FBAR process R&D, product development, and quality teams to ensure that all products and technologies are produced in a robust manufacturing environment.

Primary Objectives and Responsibilities:

• Work with peers and cross functional partners in manufacturing, development, quality and new product introduction to improve and stabilize new and existing processes
• Identify, create and maintain process controls and metrics for critical and key electrical and physical parameters
• Take ownership of newly MR'd processes to address and complete any outstanding issues and drive continuous improvement in metrics
• Establish project objectives, schedules and resource profiles for projects
• Address issues and coordinate analysis and improvement of parametric and fab metrics
• Work with QA, reliability resources, unit process owners, and product engineers to track, plan, and coordinate process change qualifications
• Develop and maintain control plans and FMEA's for processes
• Champion integration investigations and determine root cause of integrated related scrap events
• Partner with manufacturing engineering to establish qualification plans for process changes
• Participate in R&D process development to assist limited R&D resources and capture defectivity issues and manufacturability concerns
• Know the FBAR process flows in depth, including ownership and understanding of design rules
• Responsible for all NPI introduction into the fab, from mask review to implementing design values
• Close partnership with NPI teams regarding new technology intersection
• Develop technology variants to reduce cost and improve manufacturability

Technical Experience Required:

• BS (MS or higher preferred) in Physics, EE, ME, ChE, Materials Science or related engineering discipline
• Five or more years of experience in wafer process technology development and/or manufacturing
• Understanding of wafer fabrication processes and their impact on the final product
• Strong analytical skills in DOE, data analysis, SPC, FMEA and related tools
• Experience with failure analysis methods and understanding of basic device failure mechanisms
• Excellent teamwork, good verbal and written communication skills
• Basic understanding of RF principles and applications and knowledge of BAW, SAW, FBAR and associated handset architectures is helpful

Broadcom offers a competitive compensation package including base salary, annual bonus, equity, and comprehensive benefits.