R&D Engineer IC Design

Global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
$119,000 - $190,000
Embedded
Senior Software Engineer
In-Person
5,000+ Employees
8+ years of experience
Enterprise SaaS

Description For R&D Engineer IC Design

The Network Switch Group at Broadcom Inc. is seeking a Senior Physical Design Engineer for their cutting-edge networking ASIC's and multi-chip solutions team. This role focuses on 3nm high-speed physical designs and is crucial for developing some of the most complex networking products that support the latest protocols and manage large volumes of internet traffic. The position offers a competitive salary range of $119,000 - $190,000, along with comprehensive benefits including medical, dental, vision, 401(k) matching, and equity opportunities. The ideal candidate will be responsible for complex physical design tasks including floorplanning, implementation, verification, and timing closure. This is an excellent opportunity for experienced engineers looking to work with advanced semiconductor technologies in a leading global technology company. The role requires strong technical expertise, problem-solving abilities, and excellent communication skills, offering the chance to work on cutting-edge 3nm technology projects.

Last updated a month ago

Responsibilities For R&D Engineer IC Design

  • Floorplanning including multi-power domain, PG planning
  • Physical implementation of blocks and top-level including clock-tree
  • Physical verification and timing closure for block and chip-level
  • Static and dynamic IR drop analysis, signal and power EM checks
  • Methodology & Flow development of Physical Design and Timing Closure
  • Interfacing with internal and external teams including Design, IP, Library

Requirements For R&D Engineer IC Design

  • BE plus 8+ years, or ME plus 6+ years, in deep-sub-micron IC physical designs
  • Experience with TCL and Perl
  • Experience with tools such as Innovus, Calibre, LEC, PrimeTime
  • Full chip tapeout experience based on 3nm technologies preferred
  • Excellent problem solving skills
  • Excellent communication skills
  • Ability to work independently
  • Ability to learn and adapt to new tools and methodologies

Benefits For R&D Engineer IC Design

401k
Medical Insurance
Dental Insurance
Vision Insurance
Equity
  • Medical insurance
  • Dental insurance
  • Vision insurance
  • 401(k) with company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Paid holidays
  • Paid sick leave
  • Vacation time
  • Paid Family Leave
  • Annual discretionary bonus
  • Equity compensation

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