Advanced Package Technology Engineer

Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking an Advanced Package Technology Engineer to join their worldwide ASIC product development team. This role focuses on developing cutting-edge 2.5D & 3D package technology solutions, pushing the boundaries of technological advancement. The position offers an opportunity to work with state-of-the-art technology while collaborating with cross-functional teams across silicon & package design, marketing, and suppliers.

The ideal candidate will bring deep expertise in advanced package technology, particularly in 2.5D/3D development, with a strong educational background in engineering. This role combines technical leadership with hands-on development work, requiring both strategic thinking and practical implementation skills. You'll be responsible for driving innovation in package solutions while ensuring cost-effectiveness and high performance.

Working at Broadcom offers exposure to industry-leading technology development and a comprehensive benefits package including competitive salary, medical benefits, 401(k) matching, and equity opportunities. The position provides an excellent opportunity for career growth in a dynamic, global technology company that's at the forefront of semiconductor innovation. The role requires a blend of technical expertise, leadership skills, and the ability to work effectively in a global team environment.