Assembly Process & NPI Engineer

Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking an experienced Assembly Process & NPI Engineer to join their team in Singapore. This role is crucial for managing silicon Bump & package assembly suppliers and driving backend processes to achieve aggressive TQRDCEB goals. The position requires extensive experience in advanced node silicon bumping and package assembly, making it ideal for candidates with strong technical backgrounds in electrical or electronics engineering.

The role offers an opportunity to work with cutting-edge technology in semiconductor manufacturing, collaborating with cross-functional teams including package design, technology, test engineering, and quality engineering. You'll be responsible for defining processes, implementing improvements, and managing supplier relationships while contributing to new product introduction activities.

The ideal candidate will bring 7-12 years of relevant experience and a strong educational background in engineering. This position requires both technical expertise and project management skills, offering the opportunity to impact product development and manufacturing processes directly. You'll be working with state-of-the-art technology in semiconductor packaging and assembly, making this role perfect for those passionate about advancing semiconductor manufacturing capabilities.

Working at Broadcom means joining a company at the forefront of technology innovation, with a strong focus on quality and continuous improvement. The role offers exposure to emerging technologies in silicon package & substrate technologies, making it an excellent opportunity for career growth in the semiconductor industry. The position includes collaboration with global teams and the chance to drive significant improvements in manufacturing processes and cost reduction initiatives.