Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a DCIM Equipment Engineer for their Wireless Semiconductor Division (WSD). This role focuses on maintaining and optimizing thin film Deposition, Milling, and Implant equipment in a high-volume manufacturing environment. The position combines technical expertise with hands-on equipment management, requiring strong problem-solving skills and experience in semiconductor manufacturing.
The ideal candidate will have at least 5 years of experience in wafer process manufacturing equipment maintenance and troubleshooting in HVM environments. They will be responsible for ensuring quality maintenance practices, equipment optimization, and supporting both production and R&D teams. The role offers competitive compensation ranging from $91,000 to $146,000 annually, plus comprehensive benefits including medical coverage, 401(k) matching, and equity opportunities.
This position is perfect for someone who enjoys working with cutting-edge semiconductor technology and has a strong background in physics or mechanical engineering. The role provides opportunities for growth and innovation in tool selection, process improvement, and performance optimization. Located in Fort Collins, Colorado, this position offers the chance to work with a leading technology company while contributing to critical semiconductor manufacturing processes.