HBM Memory Applications Engineer
Description For HBM Memory Applications Engineer
Broadcom's ASIC Product Division (APD) is seeking a Senior HBM Memory Applications Engineer to join their team. This role is crucial in enabling customers to develop products with sustainable competitive advantages in cloud computing AI engines, supercomputers, and networking solutions.
The position involves working as a highly skilled Applications Engineer providing first-class customer support for custom silicon ASIC products that integrate Broadcom's High Bandwidth Memory (HBM) PHY IP with HBM DRAM memory modules. You'll work directly with ASIC customers and serve as an interface to DRAM suppliers for resolving HBM DRAM issues.
The ideal candidate should have extensive experience in DDR memory system design, validation, and debugging, with 8+ years of experience (BSEE) or 6+ years (MSEE). Strong expertise in memory interfaces, DRAM testing, and programming skills in languages like Ruby, C++, or Python is essential. The role requires excellent debugging abilities and strong communication skills.
Key responsibilities include developing a deep understanding of Broadcom's HBM IP, working with customers on custom silicon products, developing test scripts, and collaborating with various teams for issue resolution. You'll be involved in designing automated testing procedures and generating comprehensive analysis reports.
The position offers competitive compensation ($107,000 - $190,000) with comprehensive benefits including medical, dental, vision insurance, 401(k) matching, stock purchase programs, and various paid time off benefits. This is an excellent opportunity for experienced engineers looking to work with cutting-edge memory technology in a leading global technology company.
Responsibilities For HBM Memory Applications Engineer
- Develop understanding of Broadcom's HBM IP and system-level memory performance
- Work with ASIC customers on custom silicon products
- Develop scripts and run characterization tests
- Design automated bench level device testing procedures
- Work with HBM IP design teams for issue resolution
- Collaborate with memory suppliers for HBM DRAM issue resolution
- Generate comprehensive test reports and analysis
- Implement manufacturing test improvements
Requirements For HBM Memory Applications Engineer
- BSEE with 8+ years or MSEE with 6+ years experience in DDR memory system design
- Expert in DDR memory interfaces including PHY, controller and embedded test capability
- Experience developing DRAM memory tests
- Understanding of VLSI IC I/O & control, and built-in self-test (BIST)
- Knowledge of semiconductor technology and ASIC design flow
- Experience with lab test equipment for memory interfaces
- Programming experience in Ruby (preferred), C, C++, Perl, or Python
- Strong debugging skills
- Strong communication and presentation skills
Benefits For HBM Memory Applications Engineer
- Medical insurance
- Dental insurance
- Vision insurance
- 401(k) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Paid holidays
- Paid sick leave
- Vacation time
- Annual bonus
- Equity compensation
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