HBM Memory Applications Engineer
Description For HBM Memory Applications Engineer
Broadcom's ASIC Product Division (APD) is seeking an HBM Memory Applications Engineer to join their team in Fort Collins, CO. This role focuses on providing first-class customer support for custom silicon ASIC products integrating High Bandwidth Memory (HBM) PHY IP with HBM DRAM memory modules. The position offers competitive compensation ranging from $73,000 to $117,000 annually, plus bonuses and equity opportunities.
The ideal candidate will work directly with ASIC customers on custom silicon products and serve as an interface to DRAM suppliers. This role requires expertise in DDR memory system development and debugging, with HBM experience being a plus. The position involves developing test scripts, running characterization procedures, and working closely with various teams to resolve technical issues.
Broadcom offers a comprehensive benefits package including medical, dental, and vision insurance, 401(k) matching, stock purchase programs, and various paid time off options. The company is an equal opportunity employer committed to fostering an inclusive work environment.
The role combines technical expertise with customer interaction, making it ideal for someone who enjoys both technical challenges and collaborative work. The position is part of Broadcom's larger mission to enable customers to develop products with sustainable competitive advantages across various industries, from cloud computing AI engines to advanced wireless solutions.
Responsibilities For HBM Memory Applications Engineer
- Develop understanding of Broadcom's HBM IP and memory performance
- Work directly with ASIC customers on custom silicon products
- Develop scripts and run characterization shmoos
- Design automated bench level device testing procedures
- Work with HBM IP design teams for issue resolution
- Work with memory suppliers for HBM DRAM issues
- Generate comprehensive test reports
- Interface with DRAM suppliers for issue resolution
Requirements For HBM Memory Applications Engineer
- BSEE and 2+ years relevant experience in DDR memory system design, validation, bring-up and debugging or MSEE degree
- Experience with DDR memory interfaces including PHY, controller and embedded test capability
- Experience developing DRAM memory tests
- Understanding of VLSI IC I/O & control, and built-in self-test (BIST)
- Knowledge of semiconductor technology and ASIC design flow
- Experience with lab test equipment
- Programming experience in Ruby (preferred), C, C++, Perl, or Python
- Strong debugging skills
- Strong verbal, written communication, and presentation skills
Benefits For HBM Memory Applications Engineer
- Medical insurance
- Dental insurance
- Vision insurance
- 401(k) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Paid holidays
- Paid sick leave
- Vacation time
- Annual bonus
- Equity awards
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