IP Integration Lead Engineer

Broadcom's ASIC Product Division (APD) is seeking an IP Integration Lead Engineer to join their team in Fort Collins, CO. This role is crucial in developing die-to-die PHY IP for custom silicon ASIC products. The position involves working with cutting-edge technology in 2.5D and 3DIC ASICS, making it an exciting opportunity for experienced engineers.

The role combines technical expertise in ASIC design with leadership responsibilities, requiring both independent work and team collaboration. You'll be working with cross-functional teams including analog design, digital design, physical composition, DFT, timing, and customers. The position offers competitive compensation ranging from $91,000 to $146,000 annually, plus bonus and equity opportunities.

Broadcom provides a comprehensive benefits package and works on projects spanning from cloud computing AI engines to supercomputers and advanced wireless solutions. This is an excellent opportunity for someone with strong ASIC design experience who wants to work with leading-edge technology in a collaborative environment.

The ideal candidate will have deep understanding of ASIC design flow, experience with industry-standard tools like Cadence Innovus, and strong communication skills. The role offers the chance to work on complex technical challenges while developing and implementing critical methodologies for large-scale ASIC integration.