Broadcom's ASIC Product Division (APD) is seeking an IP Integration Lead Engineer to join their team in Fort Collins, CO. This role is crucial in developing die-to-die PHY IP for custom silicon ASIC products. The position involves working with cutting-edge technology in physical composition and integration methodologies for complex 2.5D and 3DIC ASICs. The ideal candidate will be part of a cross-functional team, contributing to projects that span cloud computing AI engines, supercomputers, networking, and advanced wireless solutions. The role offers competitive compensation ($127,000 - $203,000) and comprehensive benefits including medical, dental, vision, 401(k) matching, and equity opportunities. This is an excellent opportunity for an experienced engineer to work with bleeding-edge intellectual property and contribute to developing products with sustainable competitive advantages. The position requires extensive experience in ASIC design flow and strong collaboration skills to work effectively across multiple teams.