IP Integration Lead Engineer

Broadcom's ASIC Product Division (APD) is seeking an IP Integration Lead Engineer to join their team in Fort Collins, CO. This role is crucial in developing die-to-die PHY IP for custom silicon ASIC products. The position involves working with cutting-edge technology in 2.5D and 3DIC ASICS, requiring expertise in physical composition and integration methodologies.

The ideal candidate will be part of a cross-functional team, working on complex semiconductor solutions that power everything from cloud computing AI engines to advanced wireless solutions. This role offers an opportunity to work with bleeding-edge intellectual property and contribute to products that maintain a sustainable competitive advantage in the market.

Key responsibilities include optimizing signal IO patterns, managing power delivery systems, and coordinating with various teams including analog design, digital design, and physical composition. The role requires both technical expertise and strong communication skills, as you'll be developing integration documentation and supporting customer inquiries.

The position offers a competitive compensation package ranging from $146,000 to $234,000, plus bonus and equity opportunities. Broadcom provides comprehensive benefits including medical coverage, 401(k) matching, and stock purchase programs. This is an excellent opportunity for experienced professionals looking to work with advanced semiconductor technology in a collaborative environment.