Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
Responsibilities:
- Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, & track your work across 2+ projects simultaneously
- General flip-chip BGA package design & engineering
- Project management and customer interface for your design projects
- Contribute to efficiency improvements for the design team
Requirements:
- BSEE or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes OR MSEE or similar field and 6+ years' experience in flip-chip-BGA package design, including high-speed SerDes
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest (3 or more years is preferred)
Broadcom offers a competitive and comprehensive benefits package including medical, dental and vision plans, 401(K) participation with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.