Package Design Engineer
Description For Package Design Engineer
Broadcom, a global technology leader in semiconductor and infrastructure software solutions, is seeking an experienced Package Design Engineer for their complex flip-chip-BGA packages division. This role is integral to developing high-performance package designs for ASICs used in artificial intelligence, networking, high-performance computing, and 5G base stations. The position offers an opportunity to work with cutting-edge technology, including SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, and DDR5.
The role demands expertise in package design and layout, with a focus on signal integrity, power integrity, manufacturability, reliability, and thermal aspects. You'll be part of a worldwide R&D team, collaborating with experienced package engineering experts to create innovative package structures. The position requires strong technical skills in Cadence APD or equivalent tools, combined with project management abilities to handle multiple projects simultaneously.
This is an excellent opportunity for experienced engineers with a BSEE/MSEE background who want to work at the forefront of semiconductor technology. The role offers competitive compensation ($107,000-$190,000) and comprehensive benefits, including medical, dental, vision, 401(k) matching, and equity opportunities. Broadcom's inclusive culture and global presence provide an environment for professional growth while working on industry-leading technologies.
The ideal candidate will have 8+ years of experience with a BSEE or 6+ years with an MSEE, strong knowledge of package-level signal integrity, and excellent collaboration skills to work with a worldwide team. This role is perfect for those who want to contribute to developing next-generation semiconductor packages while working for a leading technology company.
Responsibilities For Package Design Engineer
- Overall design responsibility for ASIC package designs and layout
- Package Design of critical structures for SerDes, ADC/DAC, DDR
- Schedule, prioritize, & track work across 2+ projects simultaneously
- General flip-chip BGA package design & engineering
- Project management and customer interface for design projects
- Contribute to efficiency improvements for the design group
Requirements For Package Design Engineer
- BSEE or similar field and 8+ years experience in flip-chip-BGA package design
- MSEE or similar field and 6+ years experience in flip-chip-BGA package design
- Knowledge of package-level signal integrity and power integrity
- Cadence APD (allegro package designer) experience preferred
- 2+ years experience with Cadence APD, SiP, or equivalent package layout CAD tool
- Ability to cooperate with world-wide team across multiple time zones
- Self-management and organization skills
Benefits For Package Design Engineer
- Medical insurance
- Dental insurance
- Vision insurance
- 401(k) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Paid holidays
- Paid sick leave
- Vacation time
- Annual bonus
- Equity compensation
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