Broadcom's ASIC Products Division is seeking a Physical Design Engineer to join their team developing complex IC solutions for machine learning, cloud computing, wireless infrastructure, and networking. The role focuses on developing next-generation products with emphasis on parallel interfaces, 2.5D and 3D IC development. This position offers an exciting opportunity to work with cutting-edge technologies and advanced packaging solutions.
The ideal candidate will combine layout engineering expertise with electrical background and strong interest in advanced interconnect technologies. You'll work alongside R&D teams, contribute to IP development, interact with customers, and collaborate with manufacturing partners. The role involves implementing power grids, die-die interconnects, performing electrical analysis, and contributing to technology roadmapping.
This is an exceptional opportunity for an experienced engineer to work on industry-leading ASIC products and advanced technologies. The position offers competitive compensation including base salary, annual bonus, and equity, along with comprehensive benefits. Broadcom's collaborative environment and focus on innovation make it an ideal place for those passionate about pushing the boundaries of semiconductor technology.