Principal Adv Packaging Tech Dev Engineer

Broadcom, a global technology leader in semiconductor and infrastructure software solutions, is seeking a Principal Advanced Packaging Technology Development Engineer to drive innovations in their industry-leading AI product roadmap. This role focuses on advancing semiconductor package technology, particularly in areas of advanced substrates, heterogeneous integration with 2.5D/3D assembly, and advanced cooling solutions. The position offers a unique opportunity to work on transformative advancements in packaging technology that will differentiate Broadcom's products in the market. The ideal candidate will bring 10+ years of experience and deep expertise in advanced packaging technologies, with a proven track record of innovations through patents and publications. This high-impact role involves collaboration with business unit experts and industry partners, leading R&D initiatives, and developing novel package and system architectures. The position offers competitive compensation including base salary, annual bonus, equity awards, and comprehensive benefits. Join Broadcom to work on cutting-edge technology while being part of a team dedicated to creating transformative new technologies in advanced packaging.