Broadcom, a global leader in semiconductor and software solutions, is seeking a Senior Staff R&D Engineer for their Advanced Technology Development team. This role focuses on developing cutting-edge packaging solutions for advanced silicon node products (5nm, 3nm, 2nm and beyond). The position offers a comprehensive blend of technical leadership and hands-on engineering, working with cross-functional teams to design, develop, and implement advanced packaging solutions.
The role requires deep expertise in signal integrity, power integrity, and thermal engineering, with opportunities to work on innovative solutions for next-generation semiconductor products. You'll be responsible for managing IC packaging activities from concept through production, while collaborating with various stakeholders including business unit marketing, IC design teams, and external customers.
This is an excellent opportunity for an experienced engineer looking to work at the forefront of semiconductor packaging technology. The position offers competitive compensation ($94,000-$150,000) plus bonus and equity, along with comprehensive benefits. The ideal candidate will have a strong technical background, proven leadership skills, and a track record of innovation in semiconductor packaging technology.
Working at Broadcom means joining a diverse, innovative team that values technical excellence and creative problem-solving. The company provides opportunities for professional growth and development, while working on projects that push the boundaries of semiconductor technology.