Broadcom, a global leader in semiconductor and software solutions, is seeking a Senior Staff R&D Engineer for their Advanced Technology Development team in Penang. This role focuses on developing cutting-edge packaging solutions for advanced silicon node products (5nm, 3nm, 2nm and beyond). The position requires expertise in IC packaging, material science, and system design, working closely with cross-functional teams to deliver innovative solutions. The ideal candidate will have extensive experience in package development, signal integrity, and advanced assembly processes, contributing to next-generation semiconductor technologies. This role offers the opportunity to work with state-of-the-art technology and influence the future of semiconductor packaging, while collaborating with tier #1 customers and leading development projects. The position demands both technical expertise and leadership skills, making it ideal for someone looking to drive innovation in semiconductor packaging technology.