Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior Staff R&D Engineer for their Advanced Technology Development team. This role focuses on advanced silicon node products (5nm, 3nm, 2nm and beyond), combining expertise in package design, thermal engineering, and materials science. The position requires deep technical knowledge in signal integrity, power integrity, and advanced assembly processes.
The ideal candidate will work at the intersection of hardware design and manufacturing, collaborating with cross-functional teams to develop cutting-edge packaging solutions. They will manage projects from conception through high-volume production, requiring both technical expertise and strong project management skills. The role involves significant interaction with internal teams and external customers, making communication skills essential.
Key technical areas include custom substrate design using Cadence APD, advanced assembly processes for flipchip and MCM packages, and deep understanding of Chip Packaging Interaction. The position offers opportunities to work on innovative technologies such as 2.5D and 3DIC, contributing to the development of next-generation semiconductor solutions.
This role is perfect for someone who combines strong technical expertise with leadership abilities and wants to work at the forefront of semiconductor technology. The position offers the opportunity to impact the development of advanced node silicon products and contribute to cutting-edge technology solutions. Broadcom's commitment to innovation and technical excellence makes this an ideal role for candidates seeking to advance their careers in semiconductor technology.