R&D Engineer Physical Design

A global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions
$119,000 - $190,000
Embedded
Senior Software Engineer
In-Person
5,000+ Employees
8+ years of experience
Enterprise SaaS

Description For R&D Engineer Physical Design

Broadcom, a global technology leader in semiconductor and infrastructure software solutions, is seeking a Senior R&D Engineer for Physical Design. This role is perfect for experienced professionals with expertise in ASIC/SoC design implementation. The position offers an exciting opportunity to work with cutting-edge technology nodes and lead design closure initiatives.

The role demands a unique blend of technical expertise and leadership skills, focusing on complex design implementations including synthesis, floor planning, and physical verification. You'll be working with state-of-the-art EDA tools and contributing to high-impact projects that shape the future of semiconductor technology.

As a senior member of the team, you'll have the opportunity to lead design closure areas while collaborating with global teams. The position offers competitive compensation ($119,000 - $190,000) plus additional benefits including equity, 401(k) matching, and comprehensive healthcare coverage.

The ideal candidate will bring 8+ years of experience, strong problem-solving abilities, and expertise in timing analysis and place-and-route tools. This role provides an excellent opportunity to work with a leading technology company while advancing your career in semiconductor design.

Join Broadcom to be part of a dynamic environment that values innovation, collaboration, and technical excellence. The company's commitment to developing cutting-edge solutions and its comprehensive benefits package make this an attractive opportunity for experienced physical design engineers looking to make a significant impact in the semiconductor industry.

Last updated 11 days ago

Responsibilities For R&D Engineer Physical Design

  • Contributing to complex design implementations using cutting-edge technology nodes
  • Leading one or more areas of design closure within the team
  • Participating in peer reviews to ensure quality standards
  • Working on timing analysis and closure
  • Physical verification and constraints development

Requirements For R&D Engineer Physical Design

  • BS degree in Electrical Engineering
  • 8+ years of related experience
  • Expertise in synthesis, floor planning, equivalence checking, placement, clock tree synthesis
  • Proficiency in multiple EDA vendor solutions
  • Strong problem-solving skills
  • Experience collaborating within global teams
  • Hands-on expertise with timing analysis and place-and-route tools for ASIC/SoC design

Benefits For R&D Engineer Physical Design

Medical Insurance
Dental Insurance
Vision Insurance
401k
Equity
  • Medical insurance
  • Dental insurance
  • Vision insurance
  • 401(k) with company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Paid holidays
  • Paid sick leave
  • Vacation time
  • Paid Family Leave
  • Annual discretionary bonus
  • Equity compensation

Interested in this job?

Jobs Related To Broadcom R&D Engineer Physical Design

R&D Integration Engineer

Senior R&D Integration Engineer position for MEMS microfabrication technologies at Broadcom, focusing on FBAR development and semiconductor processing.

ASIC Verification Engineer

Senior ASIC Verification Engineer position at Broadcom, focusing on verification of cutting-edge network switch routing designs using System Verilog and advanced testing platforms.

ASIC Implementation Engineer

Senior ASIC Implementation Engineer role at Broadcom, focusing on advanced semiconductor design with competitive compensation and benefits.

IC Design Engineer

Senior IC Design Engineer position at Broadcom focusing on analog/mixed signal circuit design with 8+ years experience required.

Epitaxy Engineer

Senior Epitaxy Engineer position at Broadcom focusing on MOCVD growth and characterization methods for III-V materials and devices in semiconductor manufacturing.