Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior R&D IC Design Engineer to join their team. This role focuses on developing chips for Physical Layer Products in High Speed Optical Communication.
The position offers an exciting opportunity to work on cutting-edge technology in the semiconductor industry, with a focus on high-speed optical communication systems including 10G to 800G Ethernet and OTN networks. You'll be responsible for architecting block level designs, performing complex RTL coding, and ensuring successful silicon validation.
As an ideal candidate, you'll bring extensive experience in digital circuit design, particularly in areas such as ARM subsystems, FEC design, and digital signal processing. The role requires both technical expertise and strong collaborative skills, as you'll be working with teams across different time zones.
The position offers a competitive compensation package ranging from $107,000 to $171,000 annually, plus additional benefits including medical coverage, 401(k) matching, and equity opportunities. You'll be joining a company that values innovation and technical excellence, with opportunities to work on projects that shape the future of digital communications.
This role is perfect for an experienced engineer who enjoys hands-on IC development work and thrives in a collaborative environment. You'll have the opportunity to work on full-cycle chip development, from initial specifications through to silicon production qualification. The position requires a minimum of 8 years of experience with a BS degree or 6 years with an MS/PhD in Electrical or Computer Engineering.
Broadcom offers a comprehensive benefits package and promotes an inclusive work environment, considering qualified applicants regardless of background. The position is based in the San Francisco Bay Area, where you'll work alongside industry experts in a dynamic, fast-paced environment.