R&D Integration Engineer

Broadcom, a global leader in semiconductor and software solutions, is seeking a Senior R&D Integration Engineer to join their Wireless Semiconductor Division (WSD). This role focuses on developing cutting-edge MEMS microfabrication technologies, specifically FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies for wireless filter applications.

The position offers a competitive salary range of $127,000 - $203,000, along with comprehensive benefits including medical, dental, vision insurance, 401(k) matching, and equity opportunities. The role combines hands-on technical work with project management responsibilities, requiring 25-75% cleanroom and lab work.

The ideal candidate will have advanced education in EE, ME, or Materials Science (PhD with 7+ years, MS with 10+ years, or BS with 12+ years of experience) and extensive experience in semiconductor/MEMs processing. Key responsibilities include leading technology development from concept to manufacturing, executing DOEs, creating process flows, and evaluating new vendor capabilities.

This is an excellent opportunity for a seasoned professional who enjoys working in a highly-collaborative, team-oriented environment and has a passion for developing next-generation semiconductor technologies. The role offers significant growth potential and the chance to work with international teams while contributing to cutting-edge wireless technology development.

Working at Broadcom means joining a company that values innovation, technical excellence, and professional growth. The position provides a balance of hands-on technical work and leadership opportunities, making it ideal for someone who wants to impact the future of wireless technology while working with state-of-the-art MEMS fabrication processes.