R&D Integration Engineer
Description For R&D Integration Engineer
Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a talented R&D Integration Engineer for their Wireless Semiconductor Division (WSD). This role focuses on developing new MEMS microfabrication technologies, specifically FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies for wireless filter business.
The position offers a unique blend of hands-on technical work and project management, with 25-75% of time spent in cleanroom and characterization labs. You'll be working with cutting-edge MEMS technology, developing processes from concept to high-volume manufacturing. The role requires expertise in semiconductor processing, with particular emphasis on BEOL processing steps and MEMS component design.
As an Integration Engineer, you'll be part of a highly-collaborative, international team environment, working alongside manufacturing and development engineers. The position offers competitive compensation ($127,000 - $203,000) and comprehensive benefits including medical, dental, vision, 401(k) with company matching, and equity opportunities.
The ideal candidate will have advanced education in EE, ME, or Materials Science with significant industry experience. You'll need strong technical expertise in semiconductor/MEMs processing, combined with excellent project management and leadership skills. This role offers the opportunity to work at the forefront of MEMS technology development, making significant contributions to next-generation wireless filter products.
Working at Broadcom's Fort Collins location, you'll be part of a company that values innovation, collaboration, and personal growth. The position offers the perfect blend of technical challenges and leadership opportunities, making it ideal for experienced professionals looking to advance their careers in semiconductor technology.
Responsibilities For R&D Integration Engineer
- Hands-on visual, mechanical, and electrical evaluation of wafers
- Develop and execute DOEs, develop and verify root-cause models and solutions
- Lead technology development from concept to high-volume manufacturing readiness
- Research and evaluate new capabilities from vendors and drive tool selection process
- Create functional MEMS process flows
- View, understand, and create layout artwork
- Apply understanding of device physics and RF technology to propose new processes and devices
- Monitor technology developments in academia and industry
Requirements For R&D Integration Engineer
- PhD in EE, ME, Materials science with 7+ years experience or MS with 10+ years or BS with 12+ years
- Industrial experience as an integration or development engineer with hands-on expertise
- Experience with semiconductor/MEMs processing
- First-hand experience with film dep, photo, etch, wafer bond, wet processing
- Experience with BEOL processing steps
- Knowledge of statistical analysis and SPC methodology
- Experience with semiconductor processing equipment
- Excellent communication and leadership skills
- Ability to work well in a team environment
- High level of personal ownership and self-motivation
Benefits For R&D Integration Engineer
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave
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