Broadcom is seeking a Senior Custom ASIC Engineering Lead to join their Infrastructure chips development team. This role offers an opportunity to work on cutting-edge technology in AI, HPC, networking, and storage. The position involves leading external and internal cross-functional teams in physical design, STA, DFT, and packaging. The ideal candidate will have extensive experience with chip tape-outs and the ability to identify and resolve design problems. This role combines technical leadership with customer interaction, requiring both deep technical expertise and strong communication skills. The position offers competitive compensation including base salary, annual bonus, and equity, along with comprehensive benefits. Working at Broadcom means being part of a global technology leader that shapes the future of semiconductor and infrastructure software solutions.