Broadcom's ASIC Products Division is seeking an experienced SI/PI engineer to develop next-generation products focusing on parallel interfaces. The role combines aspects of both AE and R&D engineering, working on customer products and developing new interconnect technologies in MCM, 2.5D, and 3D spaces. The position involves collaboration with R&D teams, IP development, customers, and manufacturing partners.
The company has a strong track record in developing complex IC solutions powering internet technologies, including AI/ML, cloud computing, wireless infrastructure, and networking. They are at the forefront of advanced technologies in 3D and 2.5D interconnects.
This role offers an exciting opportunity to work on cutting-edge ASIC products and advanced technologies. The ideal candidate will be responsible for timing signoff, electromagnetic modeling, power distribution analysis, and automation of sign-off processes. They should be able to work independently across a global organization while managing multiple concurrent customers.
The position offers competitive compensation including a base salary range of $119,000 - $190,000, plus discretionary annual bonus and equity awards. Broadcom provides comprehensive benefits including medical, dental, vision insurance, 401(k) with company matching, and various other perks.