Broadcom's ASIC Products Division is seeking an experienced Signal Integrity/Power Integrity engineer to develop next-generation products focusing on parallel interfaces. The role combines aspects of both AE and R&D engineering, working on customer products and developing new interconnect technologies in MCM, 2.5D, and 3D spaces. The position involves collaboration with R&D teams, IP development, customers, and manufacturing partners.
The company has a strong track record in developing complex IC solutions powering AI/ML, cloud computing, wireless infrastructure, and networking. This role offers an exciting opportunity to work on cutting-edge ASIC products and advanced technologies in the industry. The successful candidate will be responsible for timing signoff, electromagnetic modeling, power distribution analysis, and automation of sign-off processes.
The position requires a blend of technical expertise and project management skills, with the ability to work independently across a global organization. The role offers competitive compensation, comprehensive benefits, and the opportunity to work with advanced technologies in semiconductor design. Broadcom provides a collaborative environment focused on innovation and technical excellence, making it an ideal place for experienced engineers looking to work on industry-leading solutions.