Broadcom, a global leader in semiconductor and software solutions, is seeking a Principal Wafer Fab Process Engineer for their high-volume manufacturing facility in Breinigsville, PA. This role is crucial for their Optical Systems Division (OSD), focusing on fabricating semiconductor devices that enable fiber optic communication and datacenter expansion.
The position offers an exciting opportunity to work with cutting-edge technology in semiconductor manufacturing, specifically with Indium Phosphide laser and detector device manufacturing. The role combines technical expertise with leadership responsibilities, requiring both hands-on experience and strategic thinking.
As a Principal Engineer, you'll be responsible for developing and improving critical wafer fab processes, including photolithography, dry etch, wet etch, and thin film deposition. The role demands strong analytical skills, with emphasis on data analysis, failure analysis, and yield improvement. You'll lead projects, manage process optimization, and ensure quality control through statistical process control (SPC) implementation.
The position offers competitive compensation ($107,000 - $171,000) with comprehensive benefits including medical, dental, vision, 401(k) with company matching, and equity opportunities. The facility operates 24/7, requiring flexibility and commitment to manufacturing support.
This role is ideal for someone with advanced education in Physics or Engineering, combined with significant industry experience. The successful candidate will have a strong background in semiconductor fabrication, excellent problem-solving abilities, and the capability to work effectively in a team environment. The position offers the opportunity to work with advanced technology while contributing to the growth of optical communication infrastructure.