Mechanical Engineer - Silicon One

Cisco is seeking a Mechanical Engineer for their Silicon One team. This role involves developing advanced FCBGA packaging solutions for next-generation semiconductor ICs, including 2.5D and fanout technologies. The ideal candidate will assess packaging trends, define thermal and mechanical requirements, execute test vehicle characterization, establish design rules, and manage product assembly and vendor relationships.

Key responsibilities include:

• Developing advanced packaging solutions
• Assessing technology trends and selecting partners
• Defining thermal and mechanical requirements
• Planning and executing test vehicle DOEs and characterization
• Establishing design rules for package envelopes
• Managing product assembly setup and quality controls
• Overseeing substrate and OSAT vendors for smooth NPI and HVM transition

The ideal candidate should have:

• 10+ years of industry experience
• MS in Mechanical Engineering, Material Science, or related fields
• Experience with advanced package technology development and NPI
• Knowledge of 2.5D and fanout technologies
• Ability to drive package-based design rules

Cisco offers a collaborative work environment, opportunities for innovation, and the chance to make a global impact. They value diversity and provide equal opportunities to all employees. Benefits include quality medical, dental, and vision insurance, a 401(k) plan with company matching, paid time off, and various wellbeing offerings.

Join Cisco to be part of a team that connects everything – people, processes, data, and things – to change the world for the better.