Process Integration Engineer

Join our multidisciplinary team as a Process Integration Engineer working in a state-of-the-art class 10 cleanroom environment. This role combines hands-on semiconductor processing with technical expertise in microfabrication. You'll spend 80% of your time in the cleanroom, implementing and overseeing various wafer microfabrication processing steps. The position involves working with cutting-edge precision die bonding technology, where you'll be expected to master fine-alignment D2D or D2W bonding techniques within 2-3 months.

The role offers an exciting opportunity to work with advanced semiconductor technology, utilizing various inspection and metrology tools such as optical microscopes, SEM, profilometer, and AFM. You'll be responsible for creating detailed process flows, handling sensitive semiconductor materials, and contributing to new technology development.

We offer a competitive compensation package starting from $76,530 to $93,320, plus bonus and benefits. This position requires a US citizen who can obtain security clearance, making it perfect for those interested in contributing to advanced technology development while working in a secure environment.

The ideal candidate will combine technical expertise in semiconductor processing with strong analytical and communication skills. You'll be part of a dynamic team, presenting weekly summaries and maintaining clear daily communication with project leads. This role is perfect for someone who enjoys hands-on technical work and wants to advance their career in semiconductor technology.