Senior Director Hardware Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is seeking a Senior Director Hardware Engineer to join their dynamic Manufacturing Packaging Engineering team. This role is crucial in driving Microsoft's expanding Cloud Infrastructure and powering their "Intelligent Cloud" mission.

The position requires a seasoned engineering leader with extensive experience in semiconductor IC development, manufacturing, fabrication, testing, and packaging. The ideal candidate will have 11+ years of technical engineering experience, with deep expertise in product development for high-performance computing, AI, and large-scale SoCs/chips.

As a Senior Director, you will be responsible for driving next-generation manufacturing development roadmaps, working with diverse engineering teams to develop vision for hyperscaler-class semiconductor ICs, and establishing crucial ecosystem partnerships. The role involves leading cross-functional teams, managing external vendor relationships, and ensuring manufacturability for high-volume production.

The position offers a competitive base salary range of $161,600 - $286,200 USD (higher in SF Bay Area and NYC), along with comprehensive benefits including industry-leading healthcare, educational resources, and parental leave. This is a hybrid role with up to 50% work from home flexibility.

Microsoft provides an inclusive work environment and equal opportunities for all qualified applicants. The role offers a unique opportunity to shape the future of cloud infrastructure through innovative semiconductor solutions while working with industry-leading teams and technologies.

Join Microsoft's SCHIE team to drive technological advancement in cloud computing and be part of a team that powers over 200 online businesses including Azure, Office 365, Xbox Live, and Teams.