Senior Manager, Packaging Team, ICPE

NVIDIA, the world leader in accelerated computing, is seeking a Senior Manager for their Packaging Team in Yokneam, Israel. This role offers an exciting opportunity to lead IC package development at the cutting edge of technology. The position involves managing the ASIC package engineering team and developing advanced packaging solutions for NVIDIA's Networking products.

The ideal candidate will bring 12+ years of semiconductor industry experience and 5+ years in senior technical team management. They will lead packaging and manufacturing activities from R&D to production, working with world-leading vendors and managing cross-functional teams both in Israel and abroad.

This role requires a master's degree in Material Engineering, Mechanical Engineering, Physics, or related fields. The successful candidate will demonstrate strong leadership abilities, excellent problem-solving skills, and the capability to manage multiple interfaces simultaneously. They must possess high awareness of quality, robustness, reliability, and manufacturability.

Working at NVIDIA means joining a company that's transforming major industries through AI and digital twins technology. The position offers the opportunity to work with cutting-edge technology and collaborate with the best technical and design teams in the industry. Candidates with experience in ASIC package simulations, manufacturing environment expertise, and semiconductor manufacturing background will stand out.

This role represents a unique opportunity to make a significant impact in the semiconductor industry while working for a global technology leader. The position combines technical leadership, team management, and strategic thinking, making it ideal for someone passionate about advancing semiconductor packaging technology.