FY25 Intern - Engineering Internship 2025 - 6 months, Cork
Description For FY25 Intern - Engineering Internship 2025 - 6 months, Cork
The SnapDragon Engineering team in Cork, Ireland is seeking interns across our Digital, Analog and Embedded Software Design & Verification teams. The Cork site is home to a range of digital, analog and embedded Software teams working on cutting edge IP for the latest Snapdragon chipsets.
The team works on IPs related to encryption, power control, graphics, contextual awareness, debug, processing, analog sensing, high-speed connectivity, validation and embedded Software. Each team is working with the latest toolsets and flows on bleeding edge FinFET silicon nodes in 5nm and below.
Team members work directly with architecture, software, measurement and SoC teams in Ireland and other global Qualcomm locations. Successful candidates will have the opportunity to experience how leading-edge ASICs and SoCs in advanced CMOS processes for multi-function mobile platforms are developed and will develop a wide array of skills relevant to a future career in this exciting industry.
Minimum Qualifications:
- Strong Interpersonal, communications and teamwork skills required
- Design, Coding and Scripting: Verilog or VHDL, C/C++, Python, Tcl/Perl/shell-scripting
- Verification Methodology using System Verilog/OVM/UVM
- Project work with FPGAs
- Knowledge of Low Power Design
- Knowledge of Analog Integrated Circuits
- Knowledge of wireless/wired communications and protocols, graphics/video multi-media, ARM processors or security algorithms
- Excellent computer skills (Including, but not limited to: Windows, Office, Visio)
- Dedication to successful and thorough completion of assigned tasks
Preferred Qualifications:
- Enrolled in a bachelor or master's degree in Electrical Engineering or Computer Engineering
- Coursework in: Circuits and Electronics, Signals and systems, Microelectronic Devices and Circuits, Semiconductor Devices, Feedback systems, Digital Integrated Circuits, Digital Signal Processing, Low power VLSI, Semiconductor Physics, Software Programming
- Prior Work experience not required
Please note: You must have completed your second year of a Bachelor's degree and ideally be in your second year of a Master's Degree
Internships will commence from as early as January 2025
Responsibilities For FY25 Intern - Engineering Internship 2025 - 6 months, Cork
- Work on cutting edge IP for Snapdragon chipsets
- Participate in digital, analog, and embedded software design and verification
- Collaborate with architecture, software, measurement, and SoC teams
- Gain experience in developing ASICs and SoCs for mobile platforms
Requirements For FY25 Intern - Engineering Internship 2025 - 6 months, Cork
- Strong interpersonal, communication, and teamwork skills
- Knowledge of Verilog or VHDL, C/C++, Python, Tcl/Perl/shell-scripting
- Familiarity with System Verilog/OVM/UVM verification methodology
- Experience with FPGAs
- Understanding of low power design and analog integrated circuits
- Knowledge of wireless/wired communications, graphics/video, ARM processors, or security algorithms
- Proficiency in Windows, Office, and Visio
- Dedication to task completion
- Enrolled in Electrical or Computer Engineering degree program
- Completed second year of Bachelor's or in second year of Master's degree
Benefits For FY25 Intern - Engineering Internship 2025 - 6 months, Cork
- World-class health benefit coverage for employees and eligible dependents
- Programs to build and prepare for a financially secure future
- Self and family resources for emotional/mental strength and resilience
- Wellbeing programs to support employees in living and working well
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