2025 Summer Intern-Modem Firmware DSP Engineer

Qualcomm China is seeking a talented Modem Firmware DSP Engineer intern for Summer 2025. This role offers an exceptional opportunity to work at the forefront of wireless communication technology.

As an intern, you'll be immersed in the design and implementation of modem physical layer firmware algorithms and control code. You'll work alongside world-class engineers, contributing to the architectural design and evolution of current and next-generation wireless modem technologies. The position involves hands-on experience with DSP programming and firmware tool development.

The role requires strong technical foundations in communication systems, DSP, and embedded programming. You'll need proficiency in C/C++, Assembly language, and Python, along with an understanding of fixed-point DSP programming. Candidates should be pursuing a Master's degree in Electrical Engineering, Computer Engineering, or related fields.

At Qualcomm, you'll be part of a collaborative environment where innovation thrives. The company offers comprehensive benefits, including health coverage, professional development opportunities, and mentorship programs. You'll work with leading technology experts and contribute to projects that impact global wireless communications.

This internship provides an excellent launching pad for a career in wireless technology, offering hands-on experience with cutting-edge modem technologies while working with some of the industry's brightest minds. Join Qualcomm to be part of shaping the future of wireless communication technology.