Windows Interop Test Engineer

Qualcomm China is seeking a talented Windows Interop Test Engineer to join their team in Chengdu. This role offers an exciting opportunity to work with cutting-edge technology in the Windows ecosystem, specifically focusing on USB-related testing and integration.

The position requires a strong technical background with at least 3 years of experience in BSP areas and a solid understanding of Windows platform testing. You'll be responsible for comprehensive testing of USB-related inventories, including printers, SSDs, and MAP implementations, while ensuring optimal performance, stability, and user experience.

As part of Qualcomm's engineering team, you'll work on critical projects that bridge Windows interoperability with Qualcomm's hardware solutions. Your responsibilities will span from executing basic BSP feature tests to conducting advanced use case scenarios, managing test environments, and driving automation initiatives.

The ideal candidate should possess a Bachelor's degree in Computer Science or related field, demonstrate proficiency in programming languages like C/C++, Python, and shell scripting, and have a strong foundation in USB protocols and Linux systems. Experience with printer driver development or testing is highly valued.

At Qualcomm, you'll be part of a global leader in wireless technology, working alongside talented professionals while enjoying comprehensive benefits including medical, dental, and vision insurance, 401k plans, and educational support. The company offers a collaborative environment where innovation is encouraged and career growth is supported through continuous learning opportunities.

Join Qualcomm to contribute to groundbreaking technologies while developing your expertise in Windows ecosystem testing and integration. This role offers the perfect blend of technical challenges and professional growth opportunities in one of the world's leading technology companies.