FEA Engineer

Qualcomm Technologies is seeking a highly skilled FEA Engineer to join their Data Center team, focusing on developing high-performance, energy-efficient server solutions. This role represents a unique opportunity to work with cutting-edge technology in server processor development.

The position involves working within the platform team developing high-performance servers, where you'll collaborate with cross-functional teams including packaging, electrical, thermal, mechanical, and component suppliers. Your primary responsibilities will center on structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level.

As an FEA Engineer, you'll be responsible for performing advanced numerical modeling to analyze and optimize the reliability and manufacturability of server packages and system designs. You'll support mechanical design from initial concept through detailed design and manufacturing readiness, while collaborating with internal teams to provide technical guidance.

The ideal candidate should possess a Master's degree in Mechanical Engineering or related field, with 6+ years of hands-on experience in FEA modeling within the high-tech industry. Strong proficiency in major FEA tools like ANSYS, ABAQUS, or Hypermesh is essential, along with experience in microelectronics packaging and system-level analysis.

Qualcomm offers a competitive compensation package including a salary range of $192,600 to $330,400, along with annual bonuses, RSU grants, and comprehensive benefits. The company provides a collaborative environment where innovation is encouraged and professional growth is supported through various development programs and mentorship opportunities.

Join Qualcomm to be part of a team that's transforming the industry by reimagining silicon and developing next-generation computing platforms. Your expertise will contribute directly to creating innovative solutions that push the limits of performance, energy efficiency, and scalability in data center applications.