FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship- Firmware / Prototyping - Canada (12 or 16 months)

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5G's potential into world-changing technologies and products.
Markham, ON, Canada
Embedded
Software Engineering Intern
In-Person
AI · Automotive
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Description For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship- Firmware / Prototyping - Canada (12 or 16 months)

The low-power AI, Audio, and Sensors Subsystem is at the heart of nearly every product that Qualcomm delivers, enabling our devices to hear, see, sense, and interact with the world around you, through an intelligent HW ecosystem that enables lightning-fast response times (i.e. "Ok Google"), while maintaining ultra-low power and area footprint. Ubiquitous across Qualcomm's vast product lines from our Snapdragon Mobile processors to Wearable technology including Smart Watches, Smart Glasses, AR, VR headsets, ultra-portable Bluetooth and personal assistants and a host of Automotive Infotainment, telematics and ADAS solutions.

As an intern within the LPAISS / HPASS HW team, you will work alongside our Design, DV and SW engineering and architecture team on everything from writing reference firmware for our next-gen and current-gen hardware to enabling and validating our AI engines, audio interfaces, and HW accelerators. You will gain hands-on experience writing custom firmware on our emulation environment and development hardware and be able step-through, debug your own code on a bare-metal platform.

We are looking for bright, energetic, motivated students to join our dynamic team as a Qualcomm Canada 2025 intern!

Minimum Qualifications:

  • In study towards a bachelors in one of the following: Electrical Engineering, Computer Engineering, Computer Science or related field.
  • Must have a minimum of one semester of university remaining after the internship concludes. Cannot be graduating before internship begins.
  • Knowledge of a programming language and scripting. Preferably some experience with lab equipment - scopes, etc. School projects with FPGAs a nice to have.
  • Good communication skills, Teamwork and organizational skills
  • Object Oriented Programming (OOP), C, C++, Digital Circuits
  • Real-Time Operating Systems is a bonus.
  • Computer Hardware (Caches, Busses, Memories, Clocking)

Preferred Qualifications:

  • I2S/PCM Protocols
  • Some understanding/experience with AI models and tool-kits
  • Mathematics for Machine Learning (Algebra and Geometry)
  • Relevant courses in Digital Signal Processing, Digital Filters
  • Experience writing some embedded firmware.
  • Familiar with perforce and other software development tools
  • FPGA fundamentals
  • Understanding of Data coherency, MMUs, caches

Key Responsibilities/Exposures:

  • Contribute to IP verification during the pre/post silicon phase of next generation ASICs through emulation (FPGA), and/or silicon.
  • Develop high-bandwidth performance usecases and measure system performance.
  • Participate in debug activities through the development cycle (pre- and post-silicon)
  • Using C/C++/Python to develop new usecases or enhance existing ones.
  • Develop reference models using UI tools (QT, Visual Studio .NET etc.) to interact with real hardware
  • Work with Diagnostic equipment such as Protocol Analyzers, High-speed scopes, Logic Analyzers, Lauterbach Trace32 JTAG debuggers or similar.

This internship offers a unique opportunity to work on cutting-edge low-power AI, audio, and sensor technologies across various Qualcomm products. You'll gain valuable experience in firmware development, hardware validation, and working with advanced diagnostic tools in a dynamic and innovative environment.

Last updated 2 months ago

Responsibilities For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship- Firmware / Prototyping - Canada (12 or 16 months)

  • Contribute to IP verification during pre/post silicon phase of next generation ASICs through emulation (FPGA) and/or silicon
  • Develop high-bandwidth performance usecases and measure system performance
  • Participate in debug activities through the development cycle (pre- and post-silicon)
  • Use C/C++/Python to develop new usecases or enhance existing ones
  • Develop reference models using UI tools (QT, Visual Studio .NET etc.) to interact with real hardware
  • Work with Diagnostic equipment such as Protocol Analyzers, High-speed scopes, Logic Analyzers, Lauterbach Trace32 JTAG debuggers or similar

Requirements For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship- Firmware / Prototyping - Canada (12 or 16 months)

Python
  • In study towards a bachelors in Electrical Engineering, Computer Engineering, Computer Science or related field
  • Minimum of one semester of university remaining after the internship concludes
  • Knowledge of a programming language and scripting
  • Good communication skills, teamwork and organizational skills
  • Object Oriented Programming (OOP), C, C++, Digital Circuits
  • Understanding of Computer Hardware (Caches, Busses, Memories, Clocking)

Benefits For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship- Firmware / Prototyping - Canada (12 or 16 months)

  • World-class health benefit option
  • Programs to help build and prepare for a financially secure future
  • Self and family resources for emotional/mental strength and resilience
  • Wellbeing programs and resources to support Live+Well and Work+Well

Interested in this job?