FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - HW Design / Verification - Canada (12 or 16 months)
Description For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - HW Design / Verification - Canada (12 or 16 months)
The low-power AI, Audio, and Sensors Subsystem is at the heart of nearly every product that Qualcomm delivers, enabling devices to hear, see, sense, and interact with the world through an intelligent HW ecosystem. This internship offers hands-on experience in design, verification, and modelling of ASIC HW IP and sub-systems, focusing on leading-edge low-power and multi-power domain hardware design and verification techniques.
Key responsibilities include:
- Contributing to RTL (Verilog) design for next-generation Snapdragon Display Processors
- Integrating external IP's and designing interfacing logic
- Working with the latest sub-micron technology nodes
- Using industry-standard CAD tools for RTL Linting, power analysis, and CDC Analysis
- Participating in experiments to optimize designs across power, area, and performance targets
- Using scripting languages (Python) to enhance methodologies and automate processes
For verification interns:
- Owning IP core level feature verification during design and development phases
- Learning display technologies and advanced verification methodologies
- Participating in test plan development, execution, and verification closure
- Contributing to test bench creation, assertions, and functional coverage models
- Implementing flows to automate development processes
- Participating in debug activities throughout the development cycle
The internship provides exposure to cutting-edge technologies in AI, audio processing, and sensor integration, offering a unique opportunity to work on products that are ubiquitous across Qualcomm's vast product lines, from Snapdragon Mobile processors to Wearable technology and Automotive solutions.
Qualcomm is looking for bright, energetic, and motivated students to join their dynamic team for a 12 or 16-month internship in Canada. This role offers an excellent opportunity to gain practical experience in a leading tech company while contributing to innovative projects in the field of low-power AI and audio subsystems.
Responsibilities For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - HW Design / Verification - Canada (12 or 16 months)
- Contribute to RTL (Verilog) design for next generation Snapdragon Display Processors
- Integration of external IP's and design of interfacing logic into the Display Subsystem
- Work with the latest sub-micron technology nodes
- Use industry standard CAD tools for RTL Linting, power analysis, and CDC Analysis
- Participate in experiments to optimize the Display design across power, area, and performance targets
- Use scripting languages (Python) to enhance existing methodologies and automate processes
- Own IP core level feature verification during the design and development phase
- Participate in test plan development and execution and verification closure
- Contribute to creating/maintaining test bench, assertions, and functional coverage models
- Participate in debug activities throughout the development cycle
Requirements For FY25 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - HW Design / Verification - Canada (12 or 16 months)
- In study towards a bachelor's in Electrical Engineering, Computer Engineering, Computer Science or related field
- Must have a minimum of one semester of university remaining after the internship concludes
- Knowledge of a programming language and scripting
- Good communication skills, teamwork and organizational skills
- Object Oriented Programming (OOP), C, C++, Digital Circuits
- Computer Hardware (Caches, Busses, Memories, Clocking)
