IC Package Layout Engineer, Up to Senior Staff

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities.
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Description For IC Package Layout Engineer, Up to Senior Staff

Qualcomm Semiconductor Limited is seeking an IC Package Layout Engineer to join their team in Hsinchu City, Taiwan. This role offers an opportunity to work with cutting-edge technology in 5G and connectivity solutions. The position requires expertise in package design, layout optimization, and working with multi-functional teams to achieve optimal mechanical, electrical, and thermal performance. The ideal candidate will have 3+ years of experience with a strong background in electrical engineering or related fields. They will be responsible for driving advanced package selection, implementing physical designs, and ensuring optimal package performance. The role offers comprehensive benefits including health coverage, professional development opportunities, and wellbeing programs. This is an excellent opportunity to work with industry leaders in semiconductor technology and contribute to world-changing innovations. The position combines technical expertise with collaborative teamwork, making it ideal for someone looking to advance their career in IC package design while working with state-of-the-art technology.

Last updated a day ago

Responsibilities For IC Package Layout Engineer, Up to Senior Staff

  • Own and drive advanced package selection, new generation product package structure, and configuration optimization
  • Responsible for Package/SIP physical design and layout, optimization, DV, and tape out
  • Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance
  • Implement the physical design of packages and modules for SoC
  • Interface and coordinate with multi-functional groups on new product package/SiP feasibility analysis
  • Define and develop design verification and automation strategy
  • Work multi-functionally to optimize package pin out
  • Ensure package design is optimized with SI/PI requirements
  • Drive methodology, innovations, and efficiency improvements
  • Explore, evaluate, and develop new CAD tools, design, and verification flow

Requirements For IC Package Layout Engineer, Up to Senior Staff

Java
  • Bachelor's or Master's degree in electrical engineering, mechanical engineering, material science, or related fields
  • 3+ years of experience
  • Proficient in Cadence APD & SiP
  • Basic knowledge in high-speed IO interfaces and electromagnetic field
  • Knowledge of IC packaging structures, chip-package, and package-board interaction
  • Basic knowledge of electronic packaging process and typical failure modes

Benefits For IC Package Layout Engineer, Up to Senior Staff

Medical Insurance
Dental Insurance
Vision Insurance
401k
Education Budget
  • World-class health benefit coverage
  • Financial future preparation programs
  • Emotional/mental strength and resilience support
  • Wellbeing programs
  • Continuous learning and development programs
  • Tuition reimbursement
  • Mentorship programs

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