Qualcomm Semiconductor Limited is seeking an IC Package Layout Engineer to join their team in Hsinchu City, Taiwan. This role offers an opportunity to work with cutting-edge technology in 5G and connectivity solutions. The position requires expertise in package design, layout optimization, and working with multi-functional teams to achieve optimal mechanical, electrical, and thermal performance. The ideal candidate will have 3+ years of experience with a strong background in electrical engineering or related fields. They will be responsible for driving advanced package selection, implementing physical designs, and ensuring optimal package performance. The role offers comprehensive benefits including health coverage, professional development opportunities, and wellbeing programs. This is an excellent opportunity to work with industry leaders in semiconductor technology and contribute to world-changing innovations. The position combines technical expertise with collaborative teamwork, making it ideal for someone looking to advance their career in IC package design while working with state-of-the-art technology.