Interim Engineering Intern_2025_HW

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives.
Hardware
Software Engineering Intern
In-Person
5,000+ Employees
AI

Description For Interim Engineering Intern_2025_HW

Qualcomm is seeking an Engineering Intern for their Hardware team to join in 2025. This role offers a unique opportunity to work with cutting-edge technology in 5G and mobile innovation. The intern will be involved in various aspects of hardware engineering, from SOC design to CPU architecture.

The position offers hands-on experience in hardware design, verification, and validation, working alongside industry experts in areas such as ASIC design, FPGA development, and RF/Analog circuit design. This is an excellent opportunity for students pursuing degrees in Electrical Engineering, VLSI, or related fields.

Qualcomm provides a collaborative environment where interns can contribute to real-world projects that impact global connectivity. The company's commitment to innovation is matched by its investment in employee development, offering comprehensive benefits and learning opportunities.

The ideal candidate will have strong fundamentals in hardware design, programming skills in languages like Verilog/VHDL, and a passion for technology. This internship provides valuable industry experience while working on projects that shape the future of mobile and IoT technologies.

Working at Qualcomm means joining a team of inventors and innovators who are pushing the boundaries of what's possible in mobile technology. The company's culture promotes creativity, collaboration, and continuous learning, making it an ideal place for career growth and professional development.

Last updated a month ago

Responsibilities For Interim Engineering Intern_2025_HW

  • SOC & Hard Macro Physical Design
  • SOC Validation & Debug
  • RF & Analog Layout
  • RF/Analog/Mixed Signal/Power IC Design
  • Low Power Design
  • Board and FPGA Design
  • Digital ASIC Design
  • Design/SOC Verification
  • CAD Solution Engineer
  • Design for Test (DFT)
  • CPU Design

Requirements For Interim Engineering Intern_2025_HW

Python
Java
  • Educational Background: Masters, Bachelors in Electrical Engineering, VLSI, Embedded and VLSI, ECE
  • Knowledge of Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting
  • Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout
  • Excellent analytical and problem solving skills
  • Ability to collaborate and work in teams
  • Good verbal and written communication skill

Benefits For Interim Engineering Intern_2025_HW

Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Assistance
Education Budget
  • World-class health coverage for employees and eligible dependents
  • Financial planning and security programs
  • Emotional/mental strength and resilience support
  • Wellbeing programs
  • Continuous learning and development programs
  • Tuition reimbursement
  • Mentorship programs

Interested in this job?

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